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WIRE BONDING TECHNIQUE FOR MICRO-ELECTROMECHANICAL SYSTEMS AND MICRO-DEVICES

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WIRE BONDING TECHNIQUE FOR MICRO-ELECTROMECHANICAL SYSTEMS AND MICRO-DEVICES

ORDINARY APPLICATION

Published

date

Filed on 21 March 2018

Patent Information

Application ID201831010469
Date of Application21/03/2018

Documents

NameDate
201831010469-ABSTRACT [25-02-2023(online)].pdf25/02/2023
201831010469-CLAIMS [25-02-2023(online)].pdf25/02/2023
201831010469-COMPLETE SPECIFICATION [25-02-2023(online)].pdf25/02/2023
201831010469-DRAWING [25-02-2023(online)].pdf25/02/2023
201831010469-FER_SER_REPLY [25-02-2023(online)].pdf25/02/2023
201831010469-OTHERS [25-02-2023(online)].pdf25/02/2023
201831010469-FER.pdf31/08/2022
201831010469-FORM 18 [19-02-2022(online)].pdf19/02/2022
201831010469-COMPLETE SPECIFICATION [20-03-2019(online)].pdf20/03/2019
201831010469-DRAWING [20-03-2019(online)].pdf20/03/2019
201831010469-ENDORSEMENT BY INVENTORS [20-03-2019(online)].pdf20/03/2019
201831010469-FORM-26 [11-06-2018(online)].pdf11/06/2018
201831010469-Proof of Right (MANDATORY) [11-06-2018(online)].pdf11/06/2018
201831010469-DRAWINGS [21-03-2018(online)].pdf21/03/2018
201831010469-FORM 1 [21-03-2018(online)].pdf21/03/2018
201831010469-PROVISIONAL SPECIFICATION [21-03-2018(online)].pdf21/03/2018
201831010469-STATEMENT OF UNDERTAKING (FORM 3) [21-03-2018(online)].pdf21/03/2018
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