VAPOUR CHAMBER SYSTEM

Abstract

VAPOUR CHAMBER SYSTEM The present invention relates to a vapour chamber system comprising an evaporator (1); a transport section (2); a condenser (3); and cooling systems (4), characterized in that said evaporator (1), transport section (2), and condenser (3) are with elliptical shaped groove wick structures (5) on internal walls (1a, 2a and 3a) of the evaporator, transport section, and condenser, said condenser (3) is hemispherical or cone-shaped to enhance condensate reflux to the evaporator (1), said transport section (2) is curved or cone-shaped to augment condensate reflux efficiency, said cooling systems (4) could be positioned externally or internally on the condenser (3) or wrapped spirally around the condenser to improve condensation and the reflux of condensate. The groove wick structures (5) on internal walls of the evaporator, transport section, and condenser facilitates liquid transport against gravity, improving thermal performance in vertically oriented applications and ensuring effective heat transfer in high-power density devices. Figure 1

Specification

Description:VAPOUR CHAMBER SYSTEM

FIELD OF THE INVENTION
The present invention generally relates to vapour chamber for the applications of thermal management of modern miniaturized electronic devices and industrial machinery. More particularly, the present invention relates to vapour chamber system that ensures superior heat dispersion, enhanced condensate reflux, and adaptable cooling configurations, thereby addressing the critical need for efficient heat transfer and management in high-performance applications.

BACKGROUND OF THE INVENTION
In the field of electronic devices and industrial machinery, efficient heat dissipation remains a critical challenge. Traditional cooling solutions, such as conventional heat sinks and fans, often struggle to meet the thermal management demands of high-performance components. Vapour chamber technology, characterized by its two-phase heat transfer mechanism, has emerged as a superior alternative, offering enhanced heat spreading capabilities over solid conductors. However, the efficacy of these systems is frequently hampered by limitations in condensate return flow, which is crucial for maintaining the cycle of evaporation and condensation that drives heat transfer. Traditionally, vapour chambers utilize a flat, plate-like configuration for both the evaporator and condenser sections. Said configuration, while effective in certain applications, is inherently limited by its reliance on capillary action within the wick structure to facilitate the return of condensate to the evaporator. The presence of sharp edges further intensifies the resistance to condensate flow from condenser region to evaporator region, diminishing the system's ability to dissipate heat effectively, particularly under conditions of intense thermal load. The aforementioned limitations in traditional cooling approaches underscore the necessity for a comprehensive configuration of vapour chamber systems. Emphasizing on structural innovations and the integration of sophisticated cooling strategies for applications where efficient heat transport or adiabatic and thermal management are crucial.
US9464849B2 disclosed a cooling device which is provided with an evaporator with a built-in wick, a condenser, and a loop type heat pipe which connects the evaporator and condenser in a loop and is provided with a liquid pipe and vapor pipe. The wick is provided with projecting parts which have recessed parts corresponding to the discharge ports, while the outer circumferential surfaces of the projecting parts are provided with grooves. However, the grooves, although designed to prevent dry-out, may not entirely eliminate non-evaporative zones, resulting in inefficiencies in fluid distribution and a potential decrease in overall thermal performance. Additionally, the cooling method near the condenser, which relies on heat radiating fins, may be inadequate for high-power applications, limiting its ability to manage extreme heat loads.

US20150016062A1 disclosed a power electronic module assembly according to an exemplary aspect of the present disclosure that includes, among other things, a vaporization chamber and a substrate integrated into a first surface of the vapor chamber. At least one cooling element is integrated in a second surface of the vapor chamber. The shape of the condenser is rectangular and the presence of sharp edges increases resistance to condensate flow from the condenser to the evaporator, reducing the system's heat dissipation efficiency, especially under high thermal loads.

US20150041103A1 is a vapor chamber including a housing that forms a recess within; at least one wicking structure manufactured from a bundle of wires having capillary voids there between that is disposed within the recess; and an amount of working fluid disposed within the recess and in fluid contact with the wicking structure such that fluid may move within the capillary voids in the wicking structures through capillary action. However, the wicking structure made from twisted wires with V-shaped vacancies might suffer from entrainment of vapor and liquid thereby results in reduced capillary action in extreme operational conditions.

US5560423A is a heat pipe which is flexible and thus conformable to the space in which it is to be deployed consists of two or three layers, namely, a relatively thin, highly conductive plate as a bottom layer, a plastic sheet as a top layer and wicking as an optional middle layer. However, the use of a metal bottom layer and plastic top layer may compromise durability and thermal conductivity, particularly under high temperatures or mechanical stress. Additionally, the incorporation of the middle layer's wicking material and the channels for directing condensed coolant might be prone to clogging or uneven distribution.

US6639799B2 disclosed two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. However, the use of a thinner first wall and a thicker second wall for direct heat transfer to the microelectronic die may lead to challenges in ensuring uniform thermal conductivity and mechanical stability. The condenser with heat-radiating fins attached to the thinner wall consist of limitations in cooling effectiveness if space constraints or environmental conditions impede optimal airflow around the fins.
KR101194187B1 relates to a cooling module in which a heat spreader is integrated, a method of manufacturing the same, and a cooling module of a car audio amplifier using the same. Specifically, a flat plate heat pipe for cooling an electric circuit device using a phase change latent heat of a heating medium. However, the absence of a traditional wick structure, relying instead on vacuum-injected heat medium and capillary force through grooves, may result in insufficient capillary action and potential reliability issues in heat transport.
US20060196640A1 relates to a heat transfer device that includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure. However, the presence of the multilayer wick structure results in higher thermal resistance in wall to wick and wick to vapor. The shape of the condenser is rectangular and the presence of sharp edges increases resistance to condensate flow from the condenser to the evaporator, reducing the system's heat dissipation efficiency, especially under high thermal loads.

Non-patent literature titled Integrated design and manufacturing of flat miniature heat pipes using printed circuit board technology discloses a flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. The primary challenge lies in the complexity of incorporating heat pipes directly into the laminated PCB structure, which may complicate the manufacturing process. The integration also limits the flexibility of design changes and the ability to repair or replace individual components. Additionally, the thermal performance of the heat pipes might be constrained by the board's material properties and layout, potentially leading to suboptimal heat dissipation in high-power applications.

However, the limitations of traditional vapor chamber design such as reduced condensate flow to the evaporator due to the presence of sharp edges is the problem that persists to be solved.

Accordingly, there exists a need for a vapour chamber system that addresses and resolves the inefficiencies found in conventional thermal management solutions, particularly in the realm of electronic devices and industrial machinery. There is a need for a vapour chamber system to significantly improve the efficiency of heat transfer and expand the effective surface area for heat dissipation.



OBJECTS OF THE INVENTION
One or more of the problems of the conventional prior art may be overcome by various embodiments of the system and method of the present invention.

It is the primary object of the present invention to provide a vapour chamber system that ensures superior heat dispersion, enhanced condensate reflux, and adaptable cooling configurations, thereby addressing the critical need for efficient heat transfer and management in high-performance applications.

It is another object of the present invention to provide a vapour chamber system with a hemispherical and cone-shaped condenser, aimed at enhancing condensate reflux to an evaporator.

It is another object of the present invention to provide a vapour chamber system with a curved and cone-shaped transport or adiabatic section, further augmenting condensate reflux efficiency.

It is another object of the present invention to provide a vapour chamber system with hemispherical and cone-shaped condenser and curved transport or adiabatic sections, equipped with both hydrophilic and hydrophobic wick structures especially with elliptical shaped grooves to facilitate increased heat transfer rates.

It is another object of the present invention to provide a vapour chamber system integrated with single or multiple, mini or micro-channeled cooling systems.

It is another object of the present invention, wherein the cooling systems can be positioned externally or internally on the condenser, or wrapped spirally around the condenser, thereby significantly improve condensation and the reflux of condensate.

SUMMARY OF THE INVENTION
Thus according to the basic aspect of the present invention, there is provided a vapour chamber system comprising an evaporator; a transport section; a condenser; and cooling systems,
characterized in that said evaporator, transport section, and condenser are with elliptical shaped groove wick structures on internal walls of the evaporator, transport section, and condenser,
said condenser is hemispherical or cone-shaped to enhance condensate reflux to the evaporator,
said transport section is curved or cone-shaped to augment condensate reflux efficiency,
said cooling systems could be positioned externally or internally on the condenser or wrapped spirally around the condenser to improve condensation and the reflux of condensate, and
wherein the elliptical shaped groove wick structures on internal walls of the evaporator, transport section, and condenser facilitates liquid transport against gravity, improving thermal performance in vertically oriented applications and ensuring effective heat transfer in high-power density devices.

It is another aspect of the present invention, wherein the elliptical shaped groove wick structures are either hydrophilic or hydrophobic which significantly facilitates improved boiling and condensation processes.

It is another aspect of the present invention, wherein the cooling systems are single or multiple, mini, or micro-channelled cooling methods.

It is another aspect of the present invention, wherein integration of the external cooling system with an inlet and outlet on the condenser efficiently augments heat dissipation rate.

It is another aspect of the present invention, wherein integration of the internal cooling system with an inlet and outlet minimizes thermal resistance between heat source and cooling, providing efficient thermal management in space-constrained environments.

It is another aspect of the present invention, wherein integration of the cooling system with an inlet and outlet wrapped spirally around the condenser efficiently manages heat fluxes, ensuring uniform temperature distribution across the condenser.

BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1a, 1b, 1c and 1d: illustrates a vapour chamber system according to the present invention.
Figure 2: illustrates an elliptical shaped groove wick structure according to the present invention.
Figure 3: illustrates a vapour chamber system configuration according to one embodiment of the present invention.
Figure 4: illustrates a vapour chamber system configuration according to another embodiment of the present invention.
Figure 5: illustrates a vapour chamber system configuration according to yet another embodiment of the present invention.
Figure 6: illustrates a vapour chamber system configuration according to yet another embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION WITH REFERENCE TO THE ACCOMPANYING FIGURES
The present invention as herein described relates to a vapour chamber system that ensures superior heat dispersion, enhanced condensate reflux, and adaptable cooling configurations, thereby addressing the critical need for efficient heat transfer and management in high-performance applications.

Referring to Figures 1a, 1b, 1c and 1d, the vapour chamber system comprising an evaporator (1); a transport or adiabatic section (2); a condenser (3); and cooling systems (4), characterised in that said condenser (3) is hemispherical or cone-shaped with an elliptical shaped groove wick structure (5) as depicted in Figure 2 on internal walls (1a, 2a and 3a) of the evaporator (1), transport or adiabatic section (2) and condenser (3).

In an embodiment, the hemispherical and cone-shaped condenser (3), combined with a curved transport or adiabatic section (2), fundamentally improve the reflux of condensate back to the evaporator (1). Said vapour chamber system configuration leverages gravity to assist the flow of condensate, minimizing condensate flow resistance and ensuring a more efficient cycle of evaporation and condensation.

In an embodiment, the elliptical shaped groove wick structures (5) are capable of employing both hydrophilic and hydrophobic materials which significantly facilitates improved boiling and condensation processes. The vapour chamber system optimizes the capillary action necessary for efficient heat transfer and also reduces the non-evaporative and non-condensation zones. This ensures that the evaporator (1) and condenser (3) maintain minimal temperature differentials, leading to improved heat dissipation efficiency. Said vapour chamber system offer a versatile and effective solution for addressing diverse thermal management challenges.

In an embodiment, the cooling system (4) may be internal or external cooling system.

In an embodiment, the vapour chamber system has external cooling system (4) with an inlet (4a) and outlet (4b) integrated on the condenser (3) which expands the effective surface area available for heat dissipation thereby results in a more efficient thermal management system capable of handling high thermal loads.

In another embodiment, the vapour chamber system has internal cooling system (4) with an inlet (4a) and outlet (4b) integrated directly within the chamber's structure, near the condenser (3) thereby minimizing thermal resistance between the heat source and the cooling medium, providing a compact and efficient solution for thermal management in space-constrained environments.

In another embodiment, the vapour chamber system has cooling system (4) with an inlet (4a) and outlet (4b) with spiral tubes wound over the hemispherical and cone-shaped condenser (3) thereby efficiently manages heat fluxes, ensuring a more uniform temperature distribution across the condenser. Said vapour chamber system configuration is particularly suited for high-density electronic devices and systems requiring efficient and reliable thermal management solutions.

In another embodiment, the vapour chamber system has micro or mini-channels, with single or multi-channel cooling system. The vapour chamber system utilizes advanced fluid dynamics to optimize heat dissipation, offering a scalable solution that can be tailored for specific heat flux requirements, improving thermal efficiency in compact and high-power devices.

In another embodiment, said cooling systems (4) can be positioned externally, internally, or wrapped spirally around the condenser (3), offering customizable cooling solutions to meet various application requirements.

Key features of the present invention are as follows:
Enhanced condensate reflux: The hemispherical and cone-shaped condenser (3), combined with a curved transport section (2), fundamentally improve the reflux of condensate back to the evaporator (1). The configuration leverages gravity to assist the flow of condensate, minimizing condensate flow resistance and ensuring a more efficient cycle of evaporation and condensation.

Optimized capillary action: By incorporating elliptical shaped grooves wick structures (5) that can be either hydrophilic or hydrophobic within the vapor chamber system, optimizes the capillary action necessary for efficient heat transfer and also reduces the non-evaporative and non-condensation zones. This ensures that the evaporator (1) and condenser (3) maintain minimal temperature differentials, leading to improved heat dissipation efficiency.

Increased effective surface area for heat dissipation: The vapour chamber system with integration of cooling methods (4), expands the effective surface area available for heat dissipation. This results in a more efficient thermal management system capable of handling high thermal loads.

Adaptable cooling configurations: The system's versatility is further enhanced through the integration of single or multiple, mini, or micro-channelled cooling methods. The cooling systems (4) could be positioned externally, internally, or wrapped spirally around the condenser, offering customizable cooling solutions to meet various application requirements.

Vapour chamber system configurations:
For illustration purpose:
The embodiments discussed herein are merely illustrative to make and use the invention and do not delimit the scope of the invention.

The 36 vapour chamber configurations are herein disclosed, each shaped to address specific thermal management requirements. Said 36 vapour chamber system configurations are distinguished by their evaporator, transport or adiabatic section, and condenser designs, the presence or absence of wick structures particularly elliptical shaped grooves on internal surfaces, and the incorporation of cooling methods in various arrangements.

Vapour chamber system configuration 1: Referring to Figure 3(a), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), and a curved condenser (3). The internal walls (1a, 2a and 3a) of the evaporator (1), transport or adiabatic section (2) and condenser (3) are without a wick. Said configuration facilitates efficient phase change heat transfer, maximizes the condensation rate by increasing the surface area for condensation. Further, said configuration significantly reduces manufacturing complexity and cost, while providing an enhanced thermal performance in applications where capillary action is not critical.

Vapour chamber system configuration 2: Referring to Figure 3(b), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3) and an elliptical shaped groove wick structure (5) to the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free. Said configuration optimizes condensate reflux, ensuring effective liquid return to the evaporator (1), enhancing the system's overall efficiency, and enabling consistent thermal management across varying operational conditions.

Vapour chamber system configuration 3: Referring to Figure 3(c), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3) and an elliptical shaped groove wick structure (5) to the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3). Said configuration leverages capillary action to facilitate liquid transport against gravity, improving the thermal performance in vertically oriented applications and ensuring effective heat transfer even in high-power density devices.

Vapour chamber system configuration 4: Referring to Figure 3(d), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2) and a curved condenser (3), with no wick structures on the internal walls (1a, 2a and 3a).

Vapour chamber system configuration 5: Referring to Figure 3(e), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2) and a curved condenser (3), and an elliptical shaped groove wick structure (5) to the internal walls (1a, and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 6: Referring to Figure 3(f), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2) and a curved condenser (3), and an elliptical shaped groove wick structure (5) to the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).

Vapour chamber system configuration 7: Referring to Figure 3(g), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2) and a condenser (3) with no wick coverage on the internal walls.

Vapour chamber system configuration 8: Referring to Figure 3(h), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a condenser (3) and an elliptical shaped groove wick structure (5) to the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), excluding the condenser (3) from covering elliptical shaped groove wick structure (5).

Vapour chamber system configuration 9: Referring to Figure 3(i), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a condenser (3) and an elliptical shaped groove wick structure (5) to the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).

Vapour chamber system configuration 10: Referring to Figure 4(a), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), and a cooling system (4) on the external wall of the condenser (3) with an inlet (4a) and outlet (4b). Said system is with no wick on the internal walls (1a, 2a and 3a). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 11: Referring to Figure 4(b), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), a cooling system (4) on the external wall of the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 12: Referring to Figure 4(c), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), a cooling system (4) on the external wall of the condenser with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).

Vapour chamber system configuration 13: Referring to Figure 4(d), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3) without wick on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2) and condenser (3), and a cooling system (4) on the external wall of the condenser (3) with an inlet (4a) and outlet (4b). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 14: Referring to Figure 4(e), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3), a cooling system (4) on the external wall of the condenser with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 15: Referring to Figure 4(f), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3), a cooling system (4) on the external wall of the condenser with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2) and condenser (3).

Vapour chamber system configuration 16: Referring to Figure 4(g), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2) a curved condenser (3) without wick on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3), and a cooling system (4) on the external wall of the condenser (3) with an inlet (4a) and outlet (4b). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 17: Referring to Figure 4(h), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3), a cooling system (4) on the external wall of the condenser with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 18: Referring to Figure 4(i), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3), a cooling system (4) on the external wall of the condenser with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).
Vapour chamber system configuration 19: Referring to Figure 5(a), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), and an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b). Said system is with no wick on the internal walls (1a, 2a and 3a). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 20: Referring to Figure 5(b), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 21: Referring to Figure 5(c), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3a).

Vapour chamber system configuration 22: Referring to Figure 5(d), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2) a curved condenser (3) without wick on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3a), and an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 23: Referring to Figure 5(e), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3), an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 24: Referring to Figure 5(f), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3), an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).

Vapour chamber system configuration 25: Referring to Figure 5(g), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2) a curved condenser (3) without wick on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3a), and an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 26: Referring to Figure 5(h), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3), an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 27: Referring to Figure 5(i), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3), an internally placed cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).

Vapour chamber system configuration 28: Referring to Figure 6(a), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), and a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b). Said system is with no wick on the internal walls (1a, 2a and 3a). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 29: Referring to Figure 6(b), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 30: Referring to Figure 6(c), the vapour chamber system comprises a flat evaporator (1), a flat transport or adiabatic section (2), a curved condenser (3), a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3a).

Vapour chamber system configuration 31: Referring to Figure 6(d), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3) without wick on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3a), and a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.
Vapour chamber system configuration 32: Referring to Figure 6(e), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3), a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 33: Referring to Figure 6(f), the vapour chamber system comprises a flat evaporator (1), a curved transport or adiabatic section (2), a curved condenser (3), a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3a).

Vapour chamber system configuration 34: Referring to Figure 6(g), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3) without wick on the internal walls (1a, 2a and 3a) of the evaporator (1a), adiabatic section (2a), and condenser (3), and a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b). The cooling system (4) integrates single or multiple, mini, or micro-channelled cooling system.

Vapour chamber system configuration 35: Referring to Figure 6(h), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3), a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a and 2a) of the evaporator (1) and adiabatic section (2), leaving the condenser (3) wick-free.

Vapour chamber system configuration 36: Referring to Figure 6(i), the vapour chamber system comprises a flat evaporator (1), a cone-shaped transport or adiabatic section (2), a curved condenser (3), a spiral cooling system (4) near the condenser (3) with an inlet (4a) and outlet (4b) and an elliptical shaped groove wick structure (5) on the internal walls (1a, 2a and 3a) of the evaporator (1), adiabatic section (2), and condenser (3).

The elliptical shaped groove wick structure (5) mentioned in above various configuration, can be both hydrophilic and hydrophobic, promoting increased capillary action, boiling and condensation phenomena. Each configuration is designed to address specific thermal management challenges, offering solutions for a wide range of applications from electronic devices to industrial machinery requiring efficient cooling mechanisms.

Technical advancements
Hemispherical and cone-shaped condenser, alongside a curved transport or adiabatic section wall, which collectively enhance the reflux of condensate back to the evaporator, overcoming the limitations imposed by traditional flat, plate-like designs and sharp edges that impede condensate flow.
Elliptical shaped groove wick structure optimizes the capillary action essential for efficient evaporation and condensation processes.
Ensures a minimized temperature differential across the evaporator and condenser sections, leading to more effective heat dissipation.
Enhanced condensate reflux.
Increased effective surface area for heat dissipation.
Adaptable cooling configurations.
, Claims:WE CLAIM:
1. A vapour chamber system comprising an evaporator (1); a transport section (2); a condenser (3); and cooling systems (4),
characterized in that said evaporator (1), transport section (2), and condenser (3) are with elliptical shaped groove wick structures (5) on internal walls (1a, 2a and 3a) of the evaporator (1), transport section (2), and condenser (3),
said condenser (3) is hemispherical or cone-shaped to enhance condensate reflux to the evaporator (1),
said transport section (2) is curved or cone-shaped to augment condensate reflux efficiency,
said cooling systems (4) could be positioned externally or internally on the condenser (3) or wrapped spirally around the condenser to improve condensation and the reflux of condensate, and
wherein the elliptical shaped groove wick structures (5) on internal walls (1a, 2a and 3a) of the evaporator (1), transport section (2), and condenser (3) facilitates liquid transport against gravity, improving thermal performance in vertically oriented applications and ensuring effective heat transfer in high-power density devices.

2. The vapour chamber system as claimed in claim 1, wherein the elliptical shaped groove wick structures (5) are either hydrophilic or hydrophobic which significantly facilitates improved boiling and condensation processes.

3. The vapour chamber system as claimed in claim 1, wherein the cooling systems (4) are single or multiple, mini, or micro-channelled cooling methods.

4. The vapour chamber system as claimed in claim 1, wherein integration of the external cooling system (4) with an inlet (4a) and outlet (4b) on the condenser (3) efficiently augments heat dissipation rate.

5. The vapour chamber system as claimed in claim 1, wherein integration of the internal cooling system (4) with an inlet (4a) and outlet (4b) minimizes thermal resistance between heat source and cooling, providing efficient thermal management in space-constrained environments.

6. The vapour chamber system as claimed in claim 1, wherein integration of the cooling system (4) with an inlet (4a) and outlet (4b) wrapped spirally around the condenser (3) efficiently manages heat fluxes, ensuring uniform temperature distribution across the condenser.

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