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ULTRASONIC SENSOR WITH BONDED PIEZOELECTRIC LAYER

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ULTRASONIC SENSOR WITH BONDED PIEZOELECTRIC LAYER

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 27 October 2015

Patent Information

Application ID6654/CHENP/2015
Date of Application27/10/2015

Documents

NameDate
6654-CHENP-2015-Correspondence to notify the Controller [07-01-2024(online)].pdf07/01/2024
6654-CHENP-2015-US(14)-HearingNotice-(HearingDate-08-01-2024).pdf22/12/2023
6654-CHENP-2015-ABSTRACT [11-08-2020(online)].pdf11/08/2020
6654-CHENP-2015-CLAIMS [11-08-2020(online)].pdf11/08/2020
6654-CHENP-2015-COMPLETE SPECIFICATION [11-08-2020(online)].pdf11/08/2020
6654-CHENP-2015-FER_SER_REPLY [11-08-2020(online)].pdf11/08/2020
6654-CHENP-2015-OTHERS [11-08-2020(online)].pdf11/08/2020
6654-CHENP-2015-FER.pdf28/05/2020
Form 18 [05-05-2017(online)].pdf05/05/2017
Form 3 [17-10-2016(online)].pdf17/10/2016
Form 3 [12-07-2016(online)].pdf12/07/2016
6654-CHENP-2015-CORRESPONDENCE-070116.pdf17/06/2016
6654-CHENP-2015-Correspondence-301015.pdf29/04/2016
6654-CHENP-2015-Power of Attorney-301015.pdf29/04/2016
abstract 6654-CHENP-2015.jpg14/11/2015
Description(Complete) [27-10-2015(online)].pdf27/10/2015
Drawing [27-10-2015(online)].pdf27/10/2015
Form 3 [27-10-2015(online)].pdf27/10/2015
Form 5 [27-10-2015(online)].pdf27/10/2015
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