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TRANSPARENT THROUGH GLASS CONDUCTIVE VIA IN A TRANSPARENT SUBSTRATE

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TRANSPARENT THROUGH GLASS CONDUCTIVE VIA IN A TRANSPARENT SUBSTRATE

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 2 December 2014

Patent Information

Application ID8738/CHENP/2014
Date of Application02/12/2014

Documents

NameDate
8738-CHENP-2014-Correspondence to notify the Controller [16-02-2023(online)].pdf16/02/2023
8738-CHENP-2014-US(14)-HearingNotice-(HearingDate-23-02-2023).pdf25/01/2023
Correspondence by Agent_POA_26-12-2019.pdf26/12/2019
8738-CHENP-2014-CLAIMS [20-12-2019(online)].pdf20/12/2019
8738-CHENP-2014-DRAWING [20-12-2019(online)].pdf20/12/2019
8738-CHENP-2014-FER_SER_REPLY [20-12-2019(online)].pdf20/12/2019
8738-CHENP-2014-FORM 3 [20-12-2019(online)].pdf20/12/2019
8738-CHENP-2014-FORM-26 [20-12-2019(online)].pdf20/12/2019
8738-CHENP-2014-OTHERS [20-12-2019(online)].pdf20/12/2019
8738-CHENP-2014-FER.pdf10/07/2019
Form 3 [09-05-2017(online)].pdf09/05/2017
Correspondence by Agent_Attested Copy Of Assignments_16-12-2016.pdf16/12/2016
Assignment [02-12-2016(online)].pdf02/12/2016
Form 6 [02-12-2016(online)].pdf02/12/2016
Power of Attorney [02-12-2016(online)].pdf02/12/2016
Form 3 [17-10-2016(online)].pdf17/10/2016
8738-CHENP-2014-Correspondence-F3-130516.pdf19/07/2016
8738-CHENP-2014-Form 3-130516.pdf19/07/2016
8738-CHENP-2014-Correspondence-F3-030516.pdf13/07/2016
8738-CHENP-2014-Form 3-030516.pdf13/07/2016
8738-CHENP-2014-Correspondence-F3-211215.pdf15/06/2016
8738-CHENP-2014-Form 3-211215.pdf15/06/2016
8738-CHENP-2014 ASSIGNMENT 25-05-2015.pdf25/05/2015
8738-CHENP-2014 CORRESPONDENCE OTHERS 25-05-2015.pdf25/05/2015
8738-CHENP-2014 FORM-3 25-05-2015.pdf25/05/2015
abstract 8738-CHENP-2014.jpg02/05/2015
13939-161-SPECIFICATION.pdf16/12/2014
FORM-3.pdf16/12/2014
FORM-5.pdf16/12/2014
IB304.pdf16/12/2014
QUALCOMM MEMS TECHNOLOGIES, INC.pdf16/12/2014
8738-CHENP-2014 CORRESPONDENCE OTHERS 15-12-2014.pdf15/12/2014
8738-CHENP-2014 POWER OF ATTORNEY 15-12-2014.pdf15/12/2014
8738-CHENP-2014.pdf06/12/2014

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