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THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (3DICS) WITH GRAPHENE SHIELD AND RELATED FABRICATION METHOD
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Abstract
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THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (3DICS) WITH GRAPHENE SHIELD AND RELATED FABRICATION METHOD
PCT NATIONAL PHASE APPLICATION
Published
Filed on 2 July 2015
Patent Information
| Application ID | 3917/CHENP/2015 |
| Date of Application | 02/07/2015 |
Documents
| Name | Date |
|---|---|
| 3917-CHENP-2015-FER.pdf | 17/10/2021 |
| Form 18 [27-01-2017(online)].pdf | 27/01/2017 |
| Form 3 [15-07-2016(online)].pdf | 15/07/2016 |
| 3917-CHENP-2015-ASSIGNMENT-311215.pdf | 14/06/2016 |
| 3917-CHENP-2015-Correspondence-ASSIGNMENT-311215.pdf | 14/06/2016 |
| abstract 3917-CHENP-2015.jpg | 01/08/2015 |
| COPY OF GPA.pdf | 06/07/2015 |
| FORM 2 + SPECIFICATION.pdf | 06/07/2015 |
| FORM 3.pdf | 06/07/2015 |
| FORM 5.pdf | 06/07/2015 |
| OTHER DOCUMENTS.pdf | 06/07/2015 |
| PCT IB 304.pdf | 06/07/2015 |
| 3917-CHENP-2015.pdf | 04/07/2015 |
