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THERMAL STRUCTURES ADAPTED TO ELECTRONIC DEVICE HEIGHTS IN INTEGRATED CIRCUIT (IC) PACKAGES
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THERMAL STRUCTURES ADAPTED TO ELECTRONIC DEVICE HEIGHTS IN INTEGRATED CIRCUIT (IC) PACKAGES
PCT NATIONAL PHASE APPLICATION
Published
Filed on 30 May 2023
Patent Information
| Application ID | 202347037215 |
| Date of Application | 30/05/2023 |
Documents
| Name | Date |
|---|---|
| 202347037215-FORM 3 [03-11-2023(online)].pdf | 03/11/2023 |
| 202347037215-Proof of Right [06-07-2023(online)].pdf | 06/07/2023 |
| 202347037215.pdf | 18/06/2023 |
| 202347037215-COMPLETE SPECIFICATION [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-DECLARATION OF INVENTORSHIP (FORM 5) [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-DRAWINGS [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-FORM 1 [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-POWER OF AUTHORITY [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-PRIORITY DOCUMENTS [30-05-2023(online)].pdf | 30/05/2023 |
| 202347037215-STATEMENT OF UNDERTAKING (FORM 3) [30-05-2023(online)].pdf | 30/05/2023 |
