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SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING

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SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 13 December 2016

Patent Information

Application ID201627042438
Date of Application13/12/2016

Documents

NameDate
201627042438-FER.pdf18/10/2021
201627042438.pdf11/08/2018
ABSTRACT1.JPG11/08/2018
201627042438-FORM 18 [27-06-2018(online)].pdf27/06/2018
201627042438-ORIGINAL UNDER RULE 6 (1A)-13-06-2017.pdf13/06/2017
PROOF OF RIGHT [12-06-2017(online)].pdf12/06/2017
Form 3 [04-04-2017(online)].pdf04/04/2017
Description(Complete) [13-12-2016(online)].pdf13/12/2016
Description(Complete) [13-12-2016(online)].pdf_29.pdf13/12/2016
Drawing [13-12-2016(online)].pdf13/12/2016
Form 3 [13-12-2016(online)].pdf13/12/2016
Form 5 [13-12-2016(online)].pdf13/12/2016
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