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SX1278 RF BASED EXTERNAL DEVICE FOR CONDITION MONITORING OF TWO-SLIDE DIE-CASTING MACHINES IN THE ELECTRONICS MANUFACTURING

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SX1278 RF BASED EXTERNAL DEVICE FOR CONDITION MONITORING OF TWO-SLIDE DIE-CASTING MACHINES IN THE ELECTRONICS MANUFACTURING

ORDINARY APPLICATION

Published

date

Filed on 14 November 2024

Abstract

A sx1278 rf based external device for condition monitoring of two-slide die-casting machines in the electronics manufacturing comprises EDCM_TSDTMote (20) that is equipped with ATmega64 MCU Board (17), SX1278 RF Module (10), Vibration Sensor (12), Temperature Sensor (13), Pressure sensor (14), Accelerometer (11), RTC Module (15) and Power Supply (16), is utilized for data acquisition node, allowing real-time observing of key parameters in Two-Slide Die-Casting Machines and facilitating seamless transmission of data to a centralized cloud server for in-depth analytics and forecasting preservation in the Electronics Manufacturing industry a touch screen HMI display and IoT connectivity are incorporated into the EDCM_TSDRMote, which is outfitted with an ATmega64 MCU Board, SX1278 RF Module, Touch Screen HMI Display, ESP32 Board, Piece Buzzer, and Power Supply, this allows for smooth communication with the cloud server and gives operators real-time insights, trend analyses, and alerts for efficient monitoring and maintenance of Two-Slide Die-Casting Machines in Electronics Manufacturing.

Patent Information

Application ID202411088140
Invention FieldCOMPUTER SCIENCE
Date of Application14/11/2024
Publication Number48/2024

Inventors

NameAddressCountryNationality
DR. (AR.) ATUL KUMAR SINGLALOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
DR. SHAILESH KUMAR SINGHLOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
DR. VISHAL SHARMALOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
DR. SACHIN KUMAR SINGHLOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
SANJAY SOODLOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
ARCHANA SEHGALLOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia

Applicants

NameAddressCountryNationality
LOVELY PROFESSIONAL UNIVERSITYJALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia

Specification

Description:FIELD OF THE INVENTION
This invention relates to sx1278 rf based external device for condition monitoring of two-slide die-casting machines in the electronics manufacturing
BACKGROUND OF THE INVENTION
The efficiency and maintenance of Two-Slide Die-Casting Machines in the Electronics Manufacturing industry are greatly enhanced by this innovative technique. Through the use of a network of sensors, the system monitors temperature, pressure, vibration, and other variables. Real-time data is wirelessly transmitted to a cloud-based server. This server, which is outfitted with sophisticated algorithms, carries out FFT evaluations, trend analysis, and thorough data analytics. The results are then shown on an intuitive interface, providing operators with useful information on the state of the machines.
One of the biggest challenges facing the Electronics Manufacturing industry is managing and maintaining Two-Slide Die-Casting Machines efficiently. Unexpected maintenance demands, increased downtime, and possible interruptions are all exacerbated by the lack of a comprehensive and real-time monitoring solution. Traditional methods are unable to provide timely information regarding the health of the machinery, which leads to subpar performance and increased operating costs.
CA2838549C: A piston for a die-casting machine, in particular with a cold chamber, comprises a stem which extends from a proximal end to a distal end along a piston axis and a piston head which extends from the distal end of the stem and which has a side wall with at least one sealing area suitable to form a seal on the wall of said container of the press. A lubrication circuit suitable for favouring the sliding of the piston comprises first lubrication ducts made in the stem and ending at the distal end of said stem, and second ducts made in the piston head, fluidically communicating with said first ducts and coming out in the lateral wall at least in correspondence with said sealed area.
RESEARCH GAP: A condition monitoring solution integrated with SX1278 and IoT of Two-Slide Die-Casting Machine in industrial environment is the novelty of the system.
CN204710798U: The utility model discloses a kind of automobile component die casting machine foundry goods rinsing table, comprise cleaning table top, cleaning hairbrush and shower, lifting column is connected with on the downside of cleaning table top, lifting column bottom connecting fluid cylinder pressure, cleaning table top is located at inside tank, tank left and right sides inwall is all provided with ultrasonic cleaner, support is provided with on the upside of tank, support bottom is fixedly connected on tank, support upper center is vertically provided with rotating shaft, rotating shaft bottom connects horizontally disposed brush handle, cleaning hairbrush is installed with on the downside of brush handle, the utility model automobile component die casting machine foundry goods rinsing table, adopt circulation hydro-peening, lifting is scrubbed and is cleaned the foundry goods after die casting with Ultrasonic Cleaning, cleaning performance is good, efficiency is high, without the need to manual operation, reduce labour intensity, and saved resource, reduce use cost, can carry out air-dry to foundry goods after cleaning in addition, effectively prevent foundry goods to get rusty, and rinsing table conveniently moving is quick, practicality and convenience high.
RESEARCH GAP: A condition monitoring solution integrated with SX1278 and IoT of Two-Slide Die-Casting Machine in industrial environment is the novelty of the system.
SUMMARY OF THE INVENTION
This summary is provided to introduce a selection of concepts, in a simplified format, that are further described in the detailed description of the invention.
This summary is neither intended to identify key or essential inventive concepts of the invention and nor is it intended for determining the scope of the invention.
To further clarify advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof, which is illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail with the accompanying drawings.
This cutting-edge technology works by carefully integrating cloud-based technologies with hardware components. In a few paragraphs, let's examine how this invention works. As a data acquisition node, the EDCM_TSDTMote is furnished with sensors such as the accelerometer, temperature, pressure, and vibration sensors. An ATmega64 MCU Board, which serves as the primary processing unit for gathering and analyzing sensor data, is attached to this device. The SX1278 RF Module is then used to wirelessly transfer the gathered data, guaranteeing dependable and effective communication between the monitoring equipment and the central cloud server. The EDCM_TSDRMote, on the other hand, serves as a communication gateway and user interface. It consists of an ESP32 Board to enable IoT connectivity, an ATmega64 MCU Board, a Touch Screen HMI Display for user interface, and an SX1278 RF Module for communication with the EDCM_TSDTMote. With the ESP32, real-time data transfer and control are made possible by a seamless interaction with the cloud server.
BRIEF DESCRIPTION OF THE DRAWINGS
The illustrated embodiments of the subject matter will be understood by reference to the drawings, wherein like parts are designated by like numerals throughout. The following description is intended only by way of example, and simply illustrates certain selected embodiments of devices, systems, and methods that are consistent with the subject matter as claimed herein, wherein:
FIGURE 1: SYSTEM ARCHITECTURE
The figures depict embodiments of the present subject matter for the purposes of illustration only. A person skilled in the art will easily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the disclosure described herein.
DETAILED DESCRIPTION OF THE INVENTION
The detailed description of various exemplary embodiments of the disclosure is described herein with reference to the accompanying drawings. It should be noted that the embodiments are described herein in such details as to clearly communicate the disclosure. However, the amount of details provided herein is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure as defined by the appended claims.
It is also to be understood that various arrangements may be devised that, although not explicitly described or shown herein, embody the principles of the present disclosure. Moreover, all statements herein reciting principles, aspects, and embodiments of the present disclosure, as well as specific examples, are intended to encompass equivalents thereof.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a"," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
In addition, the descriptions of "first", "second", "third", and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include at least one of the features, either explicitly or implicitly.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, e.g., those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
This cutting-edge technology works by carefully integrating cloud-based technologies with hardware components. In a few paragraphs, let's examine how this invention works. As a data acquisition node, the EDCM_TSDTMote is furnished with sensors such as the accelerometer, temperature, pressure, and vibration sensors. An ATmega64 MCU Board, which serves as the primary processing unit for gathering and analyzing sensor data, is attached to this device. The SX1278 RF Module is then used to wirelessly transfer the gathered data, guaranteeing dependable and effective communication between the monitoring equipment and the central cloud server. The EDCM_TSDRMote, on the other hand, serves as a communication gateway and user interface. It consists of an ESP32 Board to enable IoT connectivity, an ATmega64 MCU Board, a Touch Screen HMI Display for user interface, and an SX1278 RF Module for communication with the EDCM_TSDTMote. With the ESP32, real-time data transfer and control are made possible by a seamless interaction with the cloud server.
The core component of the system is the specially made cloud server, which was created to accept, process, and evaluate data sent by the EDCM_TSDTMote. After the data is received, the cloud server uses pre-programmed algorithms to extract useful information about the state of the Two-Slide Die-Casting Machines through data analytics, trending data generation, and FFT analysis. The EDCM_TSDRMote's Touch Screen HMI Display and a specially designed web dashboard both show the analysis results, which include trend charts, FFT analysis charts, and alarms. With this dual display, operators may be guaranteed to have instant access to vital information about the performance and health of the equipment. In addition, the system notifies authorities and operators via email of possible problems, enabling them to schedule repair appointments on time.
BEST METHOD OF WORKING
The EDCM_TSDTMote that is equipped with ATmega64 MCU Board, SX1278 RF Module, Vibration Sensor, Temperature Sensor, Pressure sensor, Accelerometer, RTC Module and Power Supply, is utilized for data acquisition node, allowing real-time observing of key parameters in Two-Slide Die-Casting Machines and facilitating seamless transmission of data to a centralized cloud server for in-depth analytics and forecasting preservation in the Electronics Manufacturing industry.
A touch screen HMI display and IoT connectivity are incorporated into the EDCM_TSDRMote, which is outfitted with an ATmega64 MCU Board, SX1278 RF Module, Touch Screen HMI Display, ESP32 Board, Piece Buzzer, and Power Supply. This allows for smooth communication with the cloud server and gives operators real-time insights, trend analyses, and alerts for efficient monitoring and maintenance of Two-Slide Die-Casting Machines in Electronics Manufacturing
The innovation intended to monitor the condition of Two-Slide Die-Casting Machines in Electronics Manufacturing uses an ATmega64 MCU Board integrated into both motes to facilitate effective data collection, processing, and communication between various sensors and modules.
The SX1278 RF Module, which is integrated into both motes, serves to enable wireless communication between the EDCM_TSDTMote and EDCM_TSDRMote components. This guarantees error-free data transfer for the Electronics Manufacturing sector's real-time monitoring and analysis of Two-Slide Die-Casting Machines.
The Vibration Sensor, Temperature Sensor, Pressure Sensor, and Accelerometer, all of those sensors are associated in EDCM_TSDTMote, is collectively used to allow comprehensive information acquisition, offering crucial insights into the operational health of Two-Slide Die-Casting Machines in electronics Manufacturing, facilitating actual time monitoring and predictive maintenance via the innovative condition tracking system.
The EDCM_TSDRMote's Touch Screen HMI Display serves as the user interface, giving operators access to real-time trend analysis, alerts, and insights to facilitate effective communication and decision-making during the condition monitoring of Two-Slide Die-Casting Machines used in the Electronics Manufacturing sector.
Real-time data transfer and analysis are made possible by the ESP32 Board, which is integrated into EDCM_TSDRMote and is used to support IoT connectivity, improve communication capabilities, and enable seamless integration with the cloud server. This innovative system is intended to monitor the condition of Two-Slide Die-Casting Machines in Electronics Manufacturing.
In order to enable data gathering, communication, and user interface features in the condition monitoring system for Two-Slide Die-Casting Machines within Electronics Manufacturing, the Power Supply, which is a plugin in both motes, is used.
ADVANTAGES OF THE INVENTION
1. With a variety of sensors and wireless connection capabilities, the EDCM_TSDTMote plays an essential function as a data acquisition node. It makes it possible to monitor important parameters in Two-Slide Die-Casting Machines in real time and makes data transfer to a centralized cloud server easier. In the Electronics Manufacturing sector, this procedure facilitates predictive maintenance and in-depth analytics.
2. The EDCM_TSDRMote, which has an integrated touch screen HMI display and IoT connection, serves as an essential communication gateway and user interface. Real-time insights, trend analyses, and alarms are provided to operators by this design, which guarantees smooth communication with the cloud server. These characteristics help Two-Slide Die-Casting Machines in Electronics Manufacturing be monitored and maintained efficiently.
3. In order to enable wireless communication between the EDCM_TSDTMote and EDCM_TSDRMote components, the SX1278 RF Module is essential. This module guarantees data transmission in an uninterrupted manner, allowing for real-time analysis and monitoring of Two-Slide Die-Casting Machines in the Electronics Manufacturing sector.
4. Comprehensive data collecting is made possible by the combined capability of the accelerometer, temperature sensor, pressure sensor, and vibration sensor. Through the use of an innovative condition monitoring system, this in turn offers crucial insights into the operational health of Two-Slide Die-Casting Machines in Electronics Manufacturing, providing real-time monitoring and predictive maintenance.
5. The Touch Screen HMI Display on the EDCM_TSDRMote provides operators with real-time insights, trend analysis, and alarms through an easy-to-use interface. This feature improves effective communication and decision-making in the electronics manufacturing sector when it comes to the condition monitoring of two-slide die-casting machines.
6. One of the key elements enabling IoT connectivity is the ESP32 Board. In the novel system created for condition monitoring of Two-Slide Die-Casting Machines in Electronics Manufacturing, it facilitates real-time data transfer and analysis by improving communication capabilities and enabling smooth integration with the cloud server.
, Claims:1. A sx1278 rf based external device for condition monitoring of two-slide die-casting machines in the electronics manufacturing comprises EDCM_TSDTMote (20) that is equipped with ATmega64 MCU Board (17), SX1278 RF Module (10), Vibration Sensor (12), Temperature Sensor (13), Pressure sensor (14), Accelerometer (11), RTC Module (15) and Power Supply (16), is utilized for data acquisition node, allowing real-time observing of key parameters in Two-Slide Die-Casting Machines and facilitating seamless transmission of data to a centralized cloud server for in-depth analytics and forecasting preservation in the Electronics Manufacturing industry.
2. The device as claimed in claim 1, wherein a touch screen HMI display and IoT connectivity are incorporated into the EDCM_TSDRMote, which is outfitted with an ATmega64 MCU Board, SX1278 RF Module, Touch Screen HMI Display, ESP32 Board, Piece Buzzer, and Power Supply, this allows for smooth communication with the cloud server and gives operators real-time insights, trend analyses, and alerts for efficient monitoring and maintenance of Two-Slide Die-Casting Machines in Electronics Manufacturing.
3. The device as claimed in claim 1, wherein the innovation intended to monitor the condition of Two-Slide Die-Casting Machines in Electronics Manufacturing uses an ATmega64 MCU Board integrated into both motes to facilitate effective data collection, processing, and communication between various sensors and modules.
4. The device as claimed in claim 1, wherein the SX1278 RF Module, which is integrated into both motes, serves to enable wireless communication between the EDCM_TSDTMote and EDCM_TSDRMote components, this guarantees error-free data transfer for the Electronics Manufacturing sector's real-time monitoring and analysis of Two-Slide Die-Casting Machines.
5. The device as claimed in claim 1, wherein the Vibration Sensor, Temperature Sensor, Pressure Sensor, and Accelerometer, all of those sensors are associated in EDCM_TSDTMote, is collectively used to allow comprehensive information acquisition, offering crucial insights into the operational health of Two-Slide Die-Casting Machines in electronics Manufacturing, facilitating actual time monitoring and predictive maintenance via the innovative condition tracking system.
6. The device as claimed in claim 1, wherein the EDCM_TSDRMote's Touch Screen HMI Display serves as the user interface, giving operators access to real-time trend analysis, alerts, and insights to facilitate effective communication and decision-making during the condition monitoring of Two-Slide Die-Casting Machines used in the Electronics Manufacturing sector.
7. The device as claimed in claim 1, wherein real-time data transfer and analysis are made possible by the ESP32 Board, which is integrated into EDCM_TSDRMote and is used to support IoT connectivity, improve communication capabilities, and enable seamless integration with the cloud server, this innovative system is intended to monitor the condition of Two-Slide Die-Casting Machines in Electronics Manufacturing.

8. The device as claimed in claim 1, wherein in order to enable data gathering, communication, and user interface features in the condition monitoring system for Two-Slide Die-Casting Machines within Electronics Manufacturing, the Power Supply, which is a plugin in both motes, is used.

Documents

NameDate
202411088140-COMPLETE SPECIFICATION [14-11-2024(online)].pdf14/11/2024
202411088140-DECLARATION OF INVENTORSHIP (FORM 5) [14-11-2024(online)].pdf14/11/2024
202411088140-DRAWINGS [14-11-2024(online)].pdf14/11/2024
202411088140-EDUCATIONAL INSTITUTION(S) [14-11-2024(online)].pdf14/11/2024
202411088140-EVIDENCE FOR REGISTRATION UNDER SSI [14-11-2024(online)].pdf14/11/2024
202411088140-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [14-11-2024(online)].pdf14/11/2024
202411088140-FORM 1 [14-11-2024(online)].pdf14/11/2024
202411088140-FORM FOR SMALL ENTITY(FORM-28) [14-11-2024(online)].pdf14/11/2024
202411088140-FORM-9 [14-11-2024(online)].pdf14/11/2024
202411088140-POWER OF AUTHORITY [14-11-2024(online)].pdf14/11/2024
202411088140-REQUEST FOR EARLY PUBLICATION(FORM-9) [14-11-2024(online)].pdf14/11/2024

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