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SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
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SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
PCT NATIONAL PHASE APPLICATION
Published
Filed on 20 February 2023
Patent Information
| Application ID | 202347011477 |
| Date of Application | 20/02/2023 |
Documents
| Name | Date |
|---|---|
| 202347011477-Proof of Right [26-06-2023(online)].pdf | 26/06/2023 |
| 202347011477-AMMENDED DOCUMENTS [19-04-2023(online)].pdf | 19/04/2023 |
| 202347011477-FORM 13 [19-04-2023(online)].pdf | 19/04/2023 |
| 202347011477-MARKED COPIES OF AMENDEMENTS [19-04-2023(online)].pdf | 19/04/2023 |
| 202347011477-POA [19-04-2023(online)].pdf | 19/04/2023 |
| 202347011477-RELEVANT DOCUMENTS [19-04-2023(online)].pdf | 19/04/2023 |
| 202347011477-COMPLETE SPECIFICATION [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-DECLARATION OF INVENTORSHIP (FORM 5) [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-DRAWINGS [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-FORM 1 [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-FORM 18 [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-POWER OF AUTHORITY [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-PRIORITY DOCUMENTS [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-REQUEST FOR EXAMINATION (FORM-18) [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-STATEMENT OF UNDERTAKING (FORM 3) [20-02-2023(online)].pdf | 20/02/2023 |
| 202347011477-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [20-02-2023(online)].pdf | 20/02/2023 |
