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SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 20 February 2023

Patent Information

Application ID202347011477
Date of Application20/02/2023

Documents

NameDate
202347011477-Proof of Right [26-06-2023(online)].pdf26/06/2023
202347011477-AMMENDED DOCUMENTS [19-04-2023(online)].pdf19/04/2023
202347011477-FORM 13 [19-04-2023(online)].pdf19/04/2023
202347011477-MARKED COPIES OF AMENDEMENTS [19-04-2023(online)].pdf19/04/2023
202347011477-POA [19-04-2023(online)].pdf19/04/2023
202347011477-RELEVANT DOCUMENTS [19-04-2023(online)].pdf19/04/2023
202347011477-COMPLETE SPECIFICATION [20-02-2023(online)].pdf20/02/2023
202347011477-DECLARATION OF INVENTORSHIP (FORM 5) [20-02-2023(online)].pdf20/02/2023
202347011477-DRAWINGS [20-02-2023(online)].pdf20/02/2023
202347011477-FORM 1 [20-02-2023(online)].pdf20/02/2023
202347011477-FORM 18 [20-02-2023(online)].pdf20/02/2023
202347011477-POWER OF AUTHORITY [20-02-2023(online)].pdf20/02/2023
202347011477-PRIORITY DOCUMENTS [20-02-2023(online)].pdf20/02/2023
202347011477-REQUEST FOR EXAMINATION (FORM-18) [20-02-2023(online)].pdf20/02/2023
202347011477-STATEMENT OF UNDERTAKING (FORM 3) [20-02-2023(online)].pdf20/02/2023
202347011477-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [20-02-2023(online)].pdf20/02/2023

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