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SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
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Abstract
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SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
PCT NATIONAL PHASE APPLICATION
Published
Filed on 21 December 2022
Patent Information
| Application ID | 202247074270 |
| Date of Application | 21/12/2022 |
Documents
| Name | Date |
|---|---|
| 202247074270-FORM 3 [29-05-2023(online)]-1.pdf | 29/05/2023 |
| 202247074270-FORM 3 [29-05-2023(online)].pdf | 29/05/2023 |
| 202247074270-Proof of Right [08-02-2023(online)].pdf | 08/02/2023 |
| 202247074270.pdf | 23/12/2022 |
| 202247074270-COMPLETE SPECIFICATION [21-12-2022(online)].pdf | 21/12/2022 |
| 202247074270-DECLARATION OF INVENTORSHIP (FORM 5) [21-12-2022(online)].pdf | 21/12/2022 |
| 202247074270-DRAWINGS [21-12-2022(online)].pdf | 21/12/2022 |
| 202247074270-FORM 1 [21-12-2022(online)].pdf | 21/12/2022 |
| 202247074270-POWER OF AUTHORITY [21-12-2022(online)].pdf | 21/12/2022 |
| 202247074270-PRIORITY DOCUMENTS [21-12-2022(online)].pdf | 21/12/2022 |
| 202247074270-STATEMENT OF UNDERTAKING (FORM 3) [21-12-2022(online)].pdf | 21/12/2022 |
