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SUBSTRATE COMPRISING INTERCONNECTS IN A CORE LAYER CONFIGURED FOR SKEW MATCHING
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Abstract
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SUBSTRATE COMPRISING INTERCONNECTS IN A CORE LAYER CONFIGURED FOR SKEW MATCHING
PCT NATIONAL PHASE APPLICATION
Published
Filed on 8 May 2023
Patent Information
| Application ID | 202347032394 |
| Date of Application | 08/05/2023 |
Documents
| Name | Date |
|---|---|
| 202347032394-FORM 3 [01-11-2023(online)].pdf | 01/11/2023 |
| 202347032394-Proof of Right [30-05-2023(online)].pdf | 30/05/2023 |
| 202347032394.pdf | 13/05/2023 |
| 202347032394-COMPLETE SPECIFICATION [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-DECLARATION OF INVENTORSHIP (FORM 5) [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-DRAWINGS [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-FORM 1 [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-POWER OF AUTHORITY [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-PRIORITY DOCUMENTS [08-05-2023(online)].pdf | 08/05/2023 |
| 202347032394-STATEMENT OF UNDERTAKING (FORM 3) [08-05-2023(online)].pdf | 08/05/2023 |
