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SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME
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Abstract
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SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME
PCT NATIONAL PHASE APPLICATION
Published
Filed on 7 March 2014
Patent Information
| Application ID | 1785/CHENP/2014 |
| Date of Application | 07/03/2014 |
Documents
| Name | Date |
|---|---|
| 1785-CHENP-2014-US(14)-HearingNotice-(HearingDate-15-03-2021).pdf | 17/10/2021 |
| 1785-CHENP-2014-Correspondence to notify the Controller [11-03-2021(online)].pdf | 11/03/2021 |
| 1785-CHENP-2014-ABSTRACT [06-11-2018(online)].pdf | 06/11/2018 |
| 1785-CHENP-2014-CLAIMS [06-11-2018(online)].pdf | 06/11/2018 |
| 1785-CHENP-2014-FER_SER_REPLY [06-11-2018(online)].pdf | 06/11/2018 |
| 1785-CHENP-2014-OTHERS [06-11-2018(online)].pdf | 06/11/2018 |
| 1785-CHENP-2014-PETITION UNDER RULE 137 [06-11-2018(online)].pdf | 06/11/2018 |
| 1785-CHENP-2014-FER.pdf | 10/05/2018 |
| Form 1.pdf | 10/07/2015 |
| Form 13.pdf | 10/07/2015 |
| 1785-CHENP-2014 FORM-13 09-07-2015.pdf | 09/07/2015 |
| abstract-1785-CHENP-2014.jpg | 10/11/2014 |
| Form-18(Online).pdf | 17/03/2014 |
| 1785-CHENP-2014 CORRESPONDENCE OTHERS 11-03-2014.pdf | 11/03/2014 |
| 1785-CHENP-2014 POWER OF ATTORNEY 11-03-2014.pdf | 11/03/2014 |
| Drawings.pdf | 10/03/2014 |
| Form 3.pdf | 10/03/2014 |
| Form 5.pdf | 10/03/2014 |
| Specification.pdf | 10/03/2014 |
| 1785-CHENP-2014.pdf | 07/03/2014 |
