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SOLDER JOINT STRUCTURE POWER MODULE HEAT SINK ATTACHED SUBSTRATE FOR POWER MODULE METHOD FOR PRODUCING SAID SUBSTRATE AND PASTE FOR FORMING SOLDER UNDERLAYER
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Abstract
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SOLDER JOINT STRUCTURE POWER MODULE HEAT SINK ATTACHED SUBSTRATE FOR POWER MODULE METHOD FOR PRODUCING SAID SUBSTRATE AND PASTE FOR FORMING SOLDER UNDERLAYER
PCT NATIONAL PHASE APPLICATION
Published
Filed on 19 August 2014
Patent Information
| Application ID | 6962/DELNP/2014 |
| Date of Application | 19/08/2014 |
Documents
| Name | Date |
|---|---|
| 6962-DELNP-2014-6962-DELNP-2014-Correspondence-190115.pdf | 06/04/2015 |
| 6962-DELNP-2014-6962-DELNP-2014-Form 3-190115.pdf | 06/04/2015 |
| 6962-delnp-2014-Correspondence Others-(19-01-2015).pdf | 19/01/2015 |
| 6962-delnp-2014-Form-3-(19-01-2015).pdf | 19/01/2015 |
| 6962-delnp-2014-Correspondence-Others-(26-09-2014).pdf | 26/09/2014 |
| 6962-delnp-2014-Correspondence-Others-(11-09-2014).pdf | 11/09/2014 |
| FIGURES IN.pdf | 25/08/2014 |
| FORM 3.pdf | 25/08/2014 |
| FORM 5.pdf | 25/08/2014 |
| GPOA.pdf | 25/08/2014 |
| SPEC FOR E-FILING.pdf | 25/08/2014 |
