Silicon Photonics Chip Developed for High Speed Data Transmission in Data Centers and Optical Networks

Abstract

Abstract The invention relates to a silicon photonics chip designed for high-speed data transmission in data centers and optical networks. The chip integrates waveguides, modulators, multiplexers, and photodetectors on a silicon platform to achieve data rates exceeding 400 Gbps. Its innovative features include low-loss coupling, energy-efficient thermal management, and scalability, ensuring compatibility with modern communication infrastructure.

Specification

Description:Field of the Invention
This invention pertains to the field of silicon photonics, specifically to a silicon photonics chip designed to enhance high-speed data transmission in data centers and optical communication networks.
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Background of the Invention
With the exponential growth of internet usage, cloud computing, and IoT, the demand for high-speed data transmission has surged. Current electronic data transmission systems face limitations in terms of bandwidth, energy efficiency, and scalability. Silicon photonics offers a promising alternative by integrating optical communication components on silicon-based platforms, leveraging their low cost and compatibility with existing CMOS processes.
However, existing silicon photonics chips encounter challenges such as limited bandwidth, high insertion losses, and heat dissipation issues. This invention addresses these challenges through an innovative design, enabling high-speed and energy-efficient data transmission.
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Summary of the Invention
The invention presents a silicon photonics chip that combines advanced optical waveguides, modulators, and multiplexers for high-speed data transmission. Key features include:
1. High-Speed Data Transmission: Achieves data rates exceeding 400 Gbps using dense wavelength division multiplexing (DWDM).
2. Energy Efficiency: Incorporates thermally stable materials and advanced cooling techniques to minimize power consumption.
3. Compact Design: Integrates optical modulators, detectors, and multiplexers on a single chip to reduce footprint.
4. Scalability: Supports easy integration with existing data center and optical network infrastructure.
The chip is designed using standard CMOS processes, ensuring cost-effective production.
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Detailed Description of the Invention
1. Architecture of the Silicon Photonics Chip
The chip includes:
• Optical Waveguides: Fabricated using silicon-on-insulator (SOI) technology for low-loss signal propagation.
• High-Speed Modulators: Employing Mach-Zehnder Interferometers (MZI) or ring resonators for fast modulation of optical signals.
• Photodetectors: Based on germanium-on-silicon technology for high sensitivity.
• Multiplexers/Demultiplexers: Enabling DWDM for efficient use of available bandwidth.
• Integrated Lasers: Optionally embedding hybrid silicon lasers to avoid external light sources.
2. Operational Principles
Data is transmitted as follows:
1. Input electrical signals are converted into optical signals using modulators.
2. The optical signals are multiplexed into a single fiber using an on-chip multiplexer.
3. At the receiving end, the optical signals are demultiplexed and converted back to electrical signals by photodetectors.
3. Innovative Features
• Thermal Management: Employing phase-change materials or microfluidic cooling to dissipate heat effectively.
• Low-Loss Coupling: Incorporating grating couplers for efficient light input and output.
• AI-Powered Calibration: Using machine learning algorithms to optimize the performance of optical components dynamically.
4. Applications
• High-speed interconnects in data centers.
• Optical communication networks for long-haul and metro applications.
• High-performance computing systems.
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, Claims:Claims
1. A silicon photonics chip comprising integrated optical waveguides, modulators, photodetectors, and multiplexers to achieve high-speed data transmission in optical networks.
2. The chip of claim 1, wherein the optical waveguides are fabricated using SOI technology to minimize signal loss.
3. The chip of claim 1, wherein the modulators employ MZI or ring resonators for high-speed optical modulation.
4. The chip of claim 1, further comprising an integrated cooling mechanism for thermal management.
5. The chip of claim 1, wherein AI-based algorithms dynamically optimize the chip's performance.
6. The chip of claim 1, designed to support data rates exceeding 400 Gbps using DWDM.
7. The chip of claim 1, wherein grating couplers ensure low-loss optical coupling.

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