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SEMICONDUCTOR WAFER BONDING INCORPORATING ELECTRICAL AND OPTICAL INTERCONNECTS

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SEMICONDUCTOR WAFER BONDING INCORPORATING ELECTRICAL AND OPTICAL INTERCONNECTS

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 6 December 2013

Patent Information

Application ID9728/CHENP/2013
Date of Application06/12/2013

Documents

NameDate
9728-CHENP-2013-IntimationOfGrant27-01-2023.pdf27/01/2023
9728-CHENP-2013-PatentCertificate27-01-2023.pdf27/01/2023
9728-CHENP-2013-FORM 3 [06-10-2022(online)].pdf06/10/2022
9728-CHENP-2013-Information under section 8(2) [06-10-2022(online)].pdf06/10/2022
9728-CHENP-2013-Written submissions and relevant documents [06-10-2022(online)].pdf06/10/2022
9728-CHENP-2013-Correspondence to notify the Controller [12-09-2022(online)].pdf12/09/2022
9728-CHENP-2013-US(14)-HearingNotice-(HearingDate-22-09-2022).pdf06/09/2022
9728-CHENP-2013-ABSTRACT [12-06-2019(online)].pdf12/06/2019
9728-CHENP-2013-CLAIMS [12-06-2019(online)].pdf12/06/2019
9728-CHENP-2013-COMPLETE SPECIFICATION [12-06-2019(online)].pdf12/06/2019
9728-CHENP-2013-FER_SER_REPLY [12-06-2019(online)].pdf12/06/2019
9728-CHENP-2013-OTHERS [12-06-2019(online)].pdf12/06/2019
9728-CHENP-2013-PETITION UNDER RULE 137 [12-06-2019(online)].pdf12/06/2019
9728-CHENP-2013-Information under section 8(2) (MANDATORY) [28-05-2019(online)].pdf28/05/2019
9728-CHENP-2013-FORM 3 [23-05-2019(online)].pdf23/05/2019
9728-CHENP-2013-FORM 4(ii) [20-05-2019(online)].pdf20/05/2019
9728-CHENP-2013-FER.pdf29/11/2018
9728-CHENP-2013-FORM 3 [14-08-2018(online)].pdf14/08/2018
9728-CHENP-2013-FORM 3 [22-09-2017(online)].pdf22/09/2017
Form 3 [07-09-2016(online)].pdf07/09/2016
abstrct9728-CHENP-2013.jpg29/10/2014
9728-CHENP-2013 ASSIGNMENT 11-04-2014.pdf11/04/2014
9728-CHENP-2013 CORRESPONDENCE OTHERS 11-04-2014.pdf11/04/2014
9728-CHENP-2013.pdf10/01/2014
IPO drawings BSTZ-090-IN.pdf06/12/2013
To efiling FORM 2 BSTZ-090-IN.pdf06/12/2013

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