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SEMICONDUCTOR PACKAGE STRUCTURE

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SEMICONDUCTOR PACKAGE STRUCTURE

DIVISIONAL CONVENTIONAL APPLICATION

Published

date

Filed on 14 December 2018

Patent Information

Application ID201845047408
Date of Application14/12/2018

Documents

NameDate
201845047408-IntimationOfGrant12-10-2023.pdf12/10/2023
201845047408-PatentCertificate12-10-2023.pdf12/10/2023
201845047408-PETITION UNDER RULE 137 [12-10-2023(online)].pdf12/10/2023
201845047408-Proof of Right [10-10-2023(online)].pdf10/10/2023
201845047408-FER.pdf17/10/2021
201845047408-CLAIMS [13-08-2021(online)].pdf13/08/2021
201845047408-FER_SER_REPLY [13-08-2021(online)].pdf13/08/2021
201845047408-FORM 3 [13-08-2021(online)].pdf13/08/2021
201845047408-Information under section 8(2) [13-08-2021(online)].pdf13/08/2021
201845047408-OTHERS [13-08-2021(online)].pdf13/08/2021
Correspondence by Agent_Form 26_11-02-2019.pdf11/02/2019
201845047408-FORM-26 [05-02-2019(online)].pdf05/02/2019
201845047408-FORM 3 [22-01-2019(online)].pdf22/01/2019
201845047408-FORM 18 [19-12-2018(online)].pdf19/12/2018
Correspondence by Agent_Form-5_18-12-2018.pdf18/12/2018
201845047408-COMPLETE SPECIFICATION [14-12-2018(online)].pdf14/12/2018
201845047408-DECLARATION OF INVENTORSHIP (FORM 5) [14-12-2018(online)].pdf14/12/2018
201845047408-DRAWINGS [14-12-2018(online)].pdf14/12/2018
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