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SEMICONDUCTOR PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT STRUCTURE COUPLED THERETO
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Abstract
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SEMICONDUCTOR PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT STRUCTURE COUPLED THERETO
PCT NATIONAL PHASE APPLICATION
Published
Filed on 27 July 2022
Patent Information
| Application ID | 202247043119 |
| Date of Application | 27/07/2022 |
Documents
| Name | Date |
|---|---|
| 202247043119-FORM 3 [13-01-2023(online)].pdf | 13/01/2023 |
| 202247043119-Proof of Right [18-10-2022(online)].pdf | 18/10/2022 |
| 202247043119-COMPLETE SPECIFICATION [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-DECLARATION OF INVENTORSHIP (FORM 5) [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-DRAWINGS [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-FORM 1 [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-POWER OF AUTHORITY [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-PRIORITY DOCUMENTS [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-STATEMENT OF UNDERTAKING (FORM 3) [27-07-2022(online)].pdf | 27/07/2022 |
| 202247043119-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [27-07-2022(online)].pdf | 27/07/2022 |
