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SEALED ELECTRONIC MODULE PROVIDED WITH IMPROVED FIXING MEANS, AND RELATIVE ASSEMBLY METHOD
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Abstract
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SEALED ELECTRONIC MODULE PROVIDED WITH IMPROVED FIXING MEANS, AND RELATIVE ASSEMBLY METHOD
CONVENTIONAL APPLICATION
Published
Filed on 13 October 2021
Patent Information
| Application ID | 202114046675 |
| Date of Application | 13/10/2021 |
Documents
| Name | Date |
|---|---|
| 202114046675-FORM 3 [06-04-2022(online)].pdf | 06/04/2022 |
| 202114046675-Verified English translation [06-04-2022(online)].pdf | 06/04/2022 |
| 202114046675-FORM-26 [23-12-2021(online)].pdf | 23/12/2021 |
| 202114046675-Proof of Right [23-12-2021(online)].pdf | 23/12/2021 |
| 202114046675-Certified Copy of Priority Document [07-12-2021(online)].pdf | 07/12/2021 |
| 202114046675-Correspondence-Letter [07-12-2021(online)].pdf | 07/12/2021 |
| 202114046675-Verified English translation [07-12-2021(online)].pdf | 07/12/2021 |
| 202114046675-COMPLETE SPECIFICATION [13-10-2021(online)].pdf | 13/10/2021 |
| 202114046675-DECLARATION OF INVENTORSHIP (FORM 5) [13-10-2021(online)].pdf | 13/10/2021 |
| 202114046675-DRAWINGS [13-10-2021(online)].pdf | 13/10/2021 |
| 202114046675-FORM 1 [13-10-2021(online)].pdf | 13/10/2021 |
