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POWER MODULE SUBSTRATE WITH HEAT SINK POWER MODULE SUBSTRATE WITH COOLER AND POWER MODULE
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POWER MODULE SUBSTRATE WITH HEAT SINK POWER MODULE SUBSTRATE WITH COOLER AND POWER MODULE
PCT NATIONAL PHASE APPLICATION
Published
Filed on 26 September 2014
Patent Information
| Application ID | 8075/DELNP/2014 |
| Date of Application | 26/09/2014 |
Documents
| Name | Date |
|---|---|
| PD014230IN-NP_Clean copy.pdf | 16/03/2015 |
| PD014230IN-NP_FORM-13.pdf | 16/03/2015 |
| PD014230IN-NP_Marked up copy.pdf | 16/03/2015 |
| 8075-delnp-2014-Correspondence Others-(19-02-2015).pdf | 19/02/2015 |
| 8075-delnp-2014-Form-3-(19-02-2015).pdf | 19/02/2015 |
| 8075-DELNP-2014-Correspondence-others-(15-10-2014).pdf | 15/10/2014 |
| 8075-DELNP-2014-Form-1-(15-10-2014).pdf | 15/10/2014 |
| 8075-DELNP-2014.pdf | 03/10/2014 |
| 8075-delnp-2014-Correspondence-Others-(01-10-2014).pdf | 01/10/2014 |
| FIGURES.pdf | 29/09/2014 |
| FORM 3.pdf | 29/09/2014 |
| FORM 5.pdf | 29/09/2014 |
| MITSUBISHI MATERIALS CORPORATION_GPOA.pdf | 29/09/2014 |
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