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POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE

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POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 13 November 2024

Abstract

According to an embodiment, the power module (100) comprises a power semiconductor device (1) and a connection element (2) for electrically connecting the power semiconductor device. Furthermore, the arrangement comprises a sensing element (3) for measuring a measurand. A bond section (21) of the connection element is bonded to and electrically connected with the power semiconductor device. The sensing element is mounted on the connection element and spaced from the bond section.

Patent Information

Application ID202447087657
Invention FieldPHYSICS
Date of Application13/11/2024
Publication Number47/2024

Inventors

NameAddressCountryNationality
SANTOLARIA, LluisRosengasse 5 4600 OltenSwitzerlandSwitzerland
MALEKI, MiladWeinbergstr. 45 5417 UntersiggenthalSwitzerlandSwitzerland

Applicants

NameAddressCountryNationality
HITACHI ENERGY LTDBrown-Boveri-Strasse 5 8050 ZürichSwitzerlandSwitzerland

Documents

NameDate
202447087657-FORM-26 [14-11-2024(online)].pdf14/11/2024
202447087657-COMPLETE SPECIFICATION [13-11-2024(online)].pdf13/11/2024
202447087657-DECLARATION OF INVENTORSHIP (FORM 5) [13-11-2024(online)].pdf13/11/2024
202447087657-DRAWINGS [13-11-2024(online)].pdf13/11/2024
202447087657-FORM 1 [13-11-2024(online)].pdf13/11/2024
202447087657-FORM 18 [13-11-2024(online)].pdf13/11/2024
202447087657-PROOF OF RIGHT [13-11-2024(online)].pdf13/11/2024
202447087657-REQUEST FOR EXAMINATION (FORM-18) [13-11-2024(online)].pdf13/11/2024

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