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PACKAGE FOR A MICROELECTRONIC DIE MICROELECTRONIC ASSEMBLY CONTAINING SAME MICROELECTRONIC SYSTEM AND METHOD OF REDUCING DIE STRESS IN A MICROELECTRONIC PACKAGE
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PACKAGE FOR A MICROELECTRONIC DIE MICROELECTRONIC ASSEMBLY CONTAINING SAME MICROELECTRONIC SYSTEM AND METHOD OF REDUCING DIE STRESS IN A MICROELECTRONIC PACKAGE
PCT NATIONAL PHASE APPLICATION
Published
Filed on 5 May 2014
Patent Information
| Application ID | 3370/CHENP/2014 |
| Date of Application | 05/05/2014 |
Documents
| Name | Date |
|---|---|
| 3370-CHENP-2014-RELEVANT DOCUMENTS [15-09-2023(online)].pdf | 15/09/2023 |
| 3370-CHENP-2014-RELEVANT DOCUMENTS [24-09-2022(online)].pdf | 24/09/2022 |
| 3370-CHENP-2014-IntimationOfGrant14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014-PatentCertificate14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014_Abstract_Granted_344211_14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014_Claims_Granted_344211_14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014_Description_Granted_344211_14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014_Drawings_Granted_344211_14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014_Marked Up Claims_Granted_344211_14-08-2020.pdf | 14/08/2020 |
| 3370-CHENP-2014-Written submissions and relevant documents [22-07-2020(online)].pdf | 22/07/2020 |
| 3370-CHENP-2014-Correspondence to notify the Controller [02-07-2020(online)].pdf | 02/07/2020 |
| 3370-CHENP-2014-US(14)-ExtendedHearingNotice-(HearingDate-08-07-2020).pdf | 10/06/2020 |
| 3370-CHENP-2014-Correspondence to notify the Controller [20-03-2020(online)].pdf | 20/03/2020 |
| 3370-CHENP-2014-HearingNoticeLetter-(DateOfHearing-25-03-2020).pdf | 26/02/2020 |
| 3370-CHENP-2014-ABSTRACT [05-12-2018(online)].pdf | 05/12/2018 |
| 3370-CHENP-2014-CLAIMS [05-12-2018(online)].pdf | 05/12/2018 |
| 3370-CHENP-2014-FER_SER_REPLY [05-12-2018(online)].pdf | 05/12/2018 |
| 3370-CHENP-2014-OTHERS [05-12-2018(online)].pdf | 05/12/2018 |
| 3370-CHENP-2014-PETITION UNDER RULE 137 [04-12-2018(online)].pdf | 04/12/2018 |
| Correspondence by Agent_Form26_01-10-2018.pdf | 01/10/2018 |
| 3370-CHENP-2014-FORM-26 [28-09-2018(online)].pdf | 28/09/2018 |
| 3370-CHENP-2014-FORM 3 [26-09-2018(online)].pdf | 26/09/2018 |
| 3370-CHENP-2014-Information under section 8(2) (MANDATORY) [25-09-2018(online)].pdf | 25/09/2018 |
| 3370-CHENP-2014-FER.pdf | 13/09/2018 |
| abstract-3370-CHENP-2014.jpg | 27/01/2015 |
| FORM-2.pdf | 27/01/2015 |
| FORM 2 for efiling INTL-429-IN.pdf | 06/05/2014 |
