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PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION
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Abstract
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Inventors
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PCT NATIONAL PHASE APPLICATION
Published
Filed on 11 November 2024
Abstract
A package comprising a first integrated device, a first metallization portion coupled to the first integrated device, a second integrated device, a second metallization portion coupled to the second integrated device and the first metallization portion, and an encapsulation layer coupled to the first metallization portion, the second integrated device and the second metallization portion. The first metallization portion includes at least one first dielectric layer and a first plurality of metallization interconnects. The second metallization portion includes at least one second dielectric layer and a second plurality of metallization interconnects.
Patent Information
Application ID | 202447086716 |
Invention Field | ELECTRONICS |
Date of Application | 11/11/2024 |
Publication Number | 46/2024 |
Inventors
Name | Address | Country | Nationality |
---|---|---|---|
WE, Hong Bok | 5775 Morehouse Drive San Diego, California 92121-1714 | U.S.A. | U.S.A. |
BUOT, Joan Rey Villarba | 5775 Morehouse Drive San Diego, California 92121-1714 | U.S.A. | U.S.A. |
PATIL, Aniket | 5775 Morehouse Drive San Diego, California 92121-1714 | U.S.A. | U.S.A. |
Applicants
Name | Address | Country | Nationality |
---|---|---|---|
QUALCOMM INCORPORATED | ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 | U.S.A. | U.S.A. |
Documents
Name | Date |
---|---|
202447086716-COMPLETE SPECIFICATION [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-DECLARATION OF INVENTORSHIP (FORM 5) [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-DRAWINGS [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-FORM 1 [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-FORM 18 [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-POWER OF AUTHORITY [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-PRIORITY DOCUMENTS [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-REQUEST FOR EXAMINATION (FORM-18) [11-11-2024(online)].pdf | 11/11/2024 |
202447086716-STATEMENT OF UNDERTAKING (FORM 3) [11-11-2024(online)].pdf | 11/11/2024 |
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