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PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDER RESIST LAYER
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Abstract
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PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDER RESIST LAYER
PCT NATIONAL PHASE APPLICATION
Published
Filed on 18 August 2022
Patent Information
| Application ID | 202247046969 |
| Date of Application | 18/08/2022 |
Documents
| Name | Date |
|---|---|
| 202247046969-Proof of Right [24-04-2023(online)].pdf | 24/04/2023 |
| 202247046969-FORM 3 [06-02-2023(online)].pdf | 06/02/2023 |
| 202247046969-COMPLETE SPECIFICATION [18-08-2022(online)].pdf | 18/08/2022 |
| 202247046969-DECLARATION OF INVENTORSHIP (FORM 5) [18-08-2022(online)].pdf | 18/08/2022 |
| 202247046969-DRAWINGS [18-08-2022(online)].pdf | 18/08/2022 |
| 202247046969-FORM 1 [18-08-2022(online)].pdf | 18/08/2022 |
| 202247046969-POWER OF AUTHORITY [18-08-2022(online)].pdf | 18/08/2022 |
| 202247046969-PRIORITY DOCUMENTS [18-08-2022(online)].pdf | 18/08/2022 |
| 202247046969-STATEMENT OF UNDERTAKING (FORM 3) [18-08-2022(online)].pdf | 18/08/2022 |
