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PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT
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Abstract
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PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT
PCT NATIONAL PHASE APPLICATION
Published
Filed on 21 September 2022
Patent Information
| Application ID | 202247054064 |
| Date of Application | 21/09/2022 |
Documents
| Name | Date |
|---|---|
| 202247054064-FORM 3 [21-03-2023(online)].pdf | 21/03/2023 |
| 202247054064-Proof of Right [10-11-2022(online)].pdf | 10/11/2022 |
| 202247054064-COMPLETE SPECIFICATION [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-DECLARATION OF INVENTORSHIP (FORM 5) [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-DRAWINGS [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-FORM 1 [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-POWER OF AUTHORITY [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-PRIORITY DOCUMENTS [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-STATEMENT OF UNDERTAKING (FORM 3) [21-09-2022(online)].pdf | 21/09/2022 |
| 202247054064-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [21-09-2022(online)].pdf | 21/09/2022 |
