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PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE
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Abstract
Information
Inventors
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Specification
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PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE
PCT NATIONAL PHASE APPLICATION
Published
Filed on 9 March 2023
Patent Information
| Application ID | 202327015856 |
| Date of Application | 09/03/2023 |
Documents
| Name | Date |
|---|---|
| 202327015856-FORM 3 [21-08-2023(online)].pdf | 21/08/2023 |
| 202327015856-Proof of Right [08-05-2023(online)].pdf | 08/05/2023 |
| Abstract1.jpg | 08/04/2023 |
| 202327015856-COMPLETE SPECIFICATION [09-03-2023(online)].pdf | 09/03/2023 |
| 202327015856-DECLARATION OF INVENTORSHIP (FORM 5) [09-03-2023(online)].pdf | 09/03/2023 |
| 202327015856-DRAWINGS [09-03-2023(online)].pdf | 09/03/2023 |
| 202327015856-FORM 1 [09-03-2023(online)].pdf | 09/03/2023 |
| 202327015856-POWER OF AUTHORITY [09-03-2023(online)].pdf | 09/03/2023 |
| 202327015856-STATEMENT OF UNDERTAKING (FORM 3) [09-03-2023(online)].pdf | 09/03/2023 |
