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PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE COUPLED TO THE SUBSTRATE

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PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE COUPLED TO THE SUBSTRATE

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 22 August 2022

Patent Information

Application ID202247047740
Date of Application22/08/2022

Documents

NameDate
202247047740-FORM 3 [09-02-2023(online)].pdf09/02/2023
202247047740-Correspondence_Assignment_03-10-2022.pdf03/10/2022
202247047740-Proof of Right [31-08-2022(online)].pdf31/08/2022
202247047740-COMPLETE SPECIFICATION [22-08-2022(online)].pdf22/08/2022
202247047740-DECLARATION OF INVENTORSHIP (FORM 5) [22-08-2022(online)].pdf22/08/2022
202247047740-DRAWINGS [22-08-2022(online)].pdf22/08/2022
202247047740-FORM 1 [22-08-2022(online)].pdf22/08/2022
202247047740-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [22-08-2022(online)].pdf22/08/2022
202247047740-POWER OF AUTHORITY [22-08-2022(online)].pdf22/08/2022
202247047740-PRIORITY DOCUMENTS [22-08-2022(online)].pdf22/08/2022
202247047740-PROOF OF RIGHT [22-08-2022(online)].pdf22/08/2022
202247047740-STATEMENT OF UNDERTAKING (FORM 3) [22-08-2022(online)].pdf22/08/2022
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