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PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PLANE FOR A DEVICE
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Abstract
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PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PLANE FOR A DEVICE
PCT NATIONAL PHASE APPLICATION
Published
Filed on 17 February 2022
Patent Information
| Application ID | 202247008350 |
| Date of Application | 17/02/2022 |
Documents
| Name | Date |
|---|---|
| 202247008350-FORM 18 [15-09-2023(online)].pdf | 15/09/2023 |
| 202247008350-FORM 3 [04-08-2022(online)].pdf | 04/08/2022 |
| 202247008350-Proof of Right [23-02-2022(online)].pdf | 23/02/2022 |
| 202247008350-COMPLETE SPECIFICATION [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-DECLARATION OF INVENTORSHIP (FORM 5) [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-DRAWINGS [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-FORM 1 [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-POWER OF AUTHORITY [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-PRIORITY DOCUMENTS [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-STATEMENT OF UNDERTAKING (FORM 3) [17-02-2022(online)].pdf | 17/02/2022 |
| 202247008350-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [17-02-2022(online)].pdf | 17/02/2022 |
