OPTIMIZATION OF MICROCHANNEL HEAT SINK GEOMETRY FOR ENHANCED THERMAL PERFORMANCE

Abstract

An optimized microchannel heat sink geometry is presented, which enhances thermal performance by improving heat dissipation efficiency and reducing pressure drop. This heat sink includes microchannels with variable width, optimized aspect ratios, and strategically placed flow-distribution channels that provide uniform cooling across high-power electronics. The invention provides a scalable, efficient, and customizable thermal management solution for compact, high-performance applications. The optimized geometry results in up to a 20% reduction in peak temperature compared to conventional designs, improving the lifespan and performance of electronic devices.

Specification

Description:2. FIELD OF THE INVENTION:
The present invention relates to thermal management systems, specifically to the design and optimization of microchannel heat sinks for improved thermal performance in high-power electronics and compact devices.
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3. BACKGROUND OF THE INVENTION:
High-performance and compact electronic devices generate significant heat, often leading to reduced efficiency and potential damage if not managed properly. Traditional cooling systems, such as fan-cooled heat sinks, struggle to meet the thermal demands of modern electronic devices, which require innovative solutions to maintain optimal operating temperatures. Microchannel heat sinks, owing to their high surface-area-to-volume ratios, have emerged as a promising solution, providing enhanced heat transfer capabilities in compact spaces.

However, current microchannel designs often have limitations in heat dissipation efficiency due to suboptimal geometries that cause issues like flow maldistribution, increased pressure drop, and non-uniform heat transfer. This invention addresses these issues by optimizing the microchannel geometry for improved thermal performance, achieving uniform heat dissipation with minimal pressure drop, thereby extending the lifespan and efficiency of electronic components. ________________________________________
4. OBJECTIVES OF THE INVENTION:
1. To provide a microchannel heat sink with optimized geometry to improve thermal performance and uniform heat distribution.
2. To minimize pressure drop across the heat sink, enhancing fluid flow efficiency.
3. To offer a scalable and customizable solution suitable for a variety of high-power applications.
4. To extend the lifespan of electronic devices by maintaining optimal thermal conditions. ________________________________________
5. SUMMARY OF THE INVENTION:
The invention provides an optimized microchannel heat sink design with a geometry that enhances thermal performance. Through detailed simulations and experimental analysis, the invention identifies specific geometric parameters that yield optimal heat transfer rates while minimizing pressure drop. This novel geometry enables efficient heat dissipation for applications requiring high cooling efficiency in limited space, such as in microelectronics, data centers, and automotive systems. ________________________________________
6. DETAILED DESCRIPTION OF THE INVENTION:
The invention provides a microchannel heat sink with a novel geometric design optimized for enhanced heat transfer and reduced pressure drop. The microchannel geometry is characterized by features such as variable channel width, optimized aspect ratios, and strategically placed bifurcations that facilitate improved fluid flow and thermal distribution across the heat sink. This design was developed through extensive computational fluid dynamics (CFD) simulations and finite element analysis (FEA), which demonstrated its superior thermal performance in high-power environments.

Microchannel Structure: The microchannels are designed with a variable width that widens at specific points to accommodate a greater fluid volume, reducing hotspots and achieving uniform heat transfer. The optimized aspect ratio improves heat transfer per unit area without significantly increasing the pressure drop.

Flow Optimization: The geometry includes bifurcations and flow-distribution channels at the inlet to reduce fluid stagnation and ensure that the coolant is evenly distributed across all channels. This configuration minimizes pressure gradients, ensuring smooth flow and consistent cooling.

Thermal Performance: The optimized geometry ensures that heat dissipation remains uniform along the length of each channel, which is particularly beneficial for applications with high heat flux. Experimental analysis has shown that this configuration reduces the peak temperature by up to 20% compared to conventional designs.

Manufacturing Method: The microchannel heat sink is manufactured through a precision micromachining process or additive manufacturing techniques, enabling high accuracy and scalability. The design allows for the use of various materials such as copper, aluminum, or thermally conductive polymers, depending on application requirements.
, Claims:1. A microchannel heat sink comprising an optimized geometry with variable channel width and aspect ratios, designed to enhance thermal performance by improving heat dissipation and minimizing pressure drop.
2. The microchannel heat sink as claimed in Claim 1, wherein the channels include bifurcations and flow-distribution features at the inlet to prevent fluid stagnation and ensure even flow distribution.
3. The microchannel heat sink as claimed in Claim 1, wherein the geometry is characterized by optimized aspect ratios that maximize heat transfer per unit area while maintaining low pressure gradients.

4. The microchannel heat sink as claimed in Claim 1, wherein the manufacturing process involves precision micromachining or additive manufacturing techniques to achieve the optimized geometry.
5. A method of improving thermal performance in microchannel heat sinks comprising:

a. Designing microchannels with variable width to reduce hotspots;
b. Implementing flow-distribution channels and bifurcations to ensure uniform fluid flow;
c. Optimizing channel aspect ratios to enhance heat transfer efficiency;
d. Manufacturing the heat sink using precision micromachining or additive manufacturing

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