MOUNTING APPARATUS WITH PRESSURE SENSORS AND VIBRATION-DAMPENING FOR COMPONENT ALIGNMENT

Abstract

Abstract The present disclosure provides a system for mounting a component onto a substrate. The system includes a mounting head that presses said component onto said substrate. The mounting head comprises embedded pressure sensors that facilitate real-time monitoring. A moving unit positioned adjacent to the mounting head includes a Z-axis motor that moves the mounting head along a vertical axis. A vibration-dampening unit is positioned between the mounting head and the Z-axis motor. The vibration-dampening unit reduces vibrations during movement of the mounting head, thereby allowing precise positioning of the mounting head in relation to the substrate. Dated 11 November 2024 Jigneshbhai Mungalpara IN/PA- 2640 Agent for the Applicant

Specification

Description:Mounting Apparatus with Pressure Sensors and Vibration-Dampening for Component Alignment
Field of the Invention
[0001] The present disclosure generally relates to mounting systems. Further, the present disclosure particularly relates to a system for mounting a component onto a substrate.
Background
[0002] The background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] Manufacturing systems frequently require mechanisms to mount components onto substrates with high levels of accuracy and stability. Such systems are typically used in electronics, precision machinery, and various industrial processes where small component placement on substrates must be controlled to precise tolerances. In many conventional systems, mounting heads are utilized to exert controlled pressure while aligning components onto substrates. The effectiveness of such systems relies on maintaining stability and accuracy during mounting, particularly under dynamic operating conditions. Various systems have been developed to address the need for such high-precision component mounting and positioning.
[0004] A known method involves the use of standard robotic arms with end effectors to achieve component placement onto substrates. Robotic systems rely on programmed movement control and pre-set calibration, enabling component positioning onto designated locations on substrates. However, maintaining accuracy during the component mounting process is frequently challenging, as various external factors, including vibrations and environmental interference, tend to affect the position of the mounting head relative to the substrate. Consequently, robotic mounting systems often struggle with achieving high levels of positioning accuracy. Additional issues arise from the impact of operational wear on the robotic arm, causing accuracy to degrade over time. Thus, robotic systems do not consistently maintain accuracy for applications requiring precise component placement.
[0005] An alternative approach includes the use of pneumatic or hydraulic press systems to secure components onto substrates. Such systems rely on applied pressure to maintain component position on substrates; however, external factors such as vibration and mechanical resonance often reduce their effectiveness. Conventional pneumatic or hydraulic systems lack the necessary control mechanisms to compensate for or dampen vibrations, resulting in misalignment between the component and substrate during operation. Additional limitations of these systems involve the dependency on complex infrastructure for pneumatic or hydraulic pressure control, which restricts the adaptability of such systems for dynamic manufacturing environments.
[0006] Another conventional solution involves the use of servo-controlled systems to achieve vertical movement and pressure control for mounting components. In such systems, servo motors provide a mechanism for controlled vertical movement of the mounting head, offering improved accuracy and positioning capabilities compared to pneumatic or robotic systems. Despite providing enhanced control over vertical movement, servo-based systems often experience difficulty in isolating the mounting head from external vibrations. Any vibrations transmitted through the mounting structure reduce the stability of the mounting head, adversely affecting positioning accuracy and overall effectiveness in maintaining a controlled application of pressure. Such limitations are further complicated by the requirement for regular recalibration and maintenance of the servo motors, contributing to increased operational costs and reduced reliability.
[0007] In addition to the discussed approaches, further systems have been developed incorporating active damping techniques, including the use of accelerometers and gyroscopes to stabilize mounting heads. Such systems attempt to reduce vibrations and maintain positioning accuracy by actively monitoring movement and applying corrective actions. However, these active damping systems are complex and require constant feedback from sensors to adjust positioning and movement. The reliance on continuous feedback and adjustments imposes constraints on operational speed, thereby reducing the efficiency of the component mounting process. Further, active damping systems are generally associated with high production and maintenance costs, limiting their applicability for large-scale manufacturing.
[0008] In light of the above discussion, there exists an urgent need for solutions that overcome the problems associated with conventional systems and/or techniques for component mounting onto substrates.
[0009] All references, including publications, patent applications, and patents, cited herein are hereby incorporated by reference to the same extent as if each reference were individually and specifically indicated to be incorporated by reference and were set forth in its entirety herein.
[00010] It also shall be noted that as used herein and in the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. This invention can be achieved by means of hardware including several different elements or by means of a suitably programmed computer. In the unit claims that list several means, several ones among these means can be specifically embodied in the same hardware item. The use of such words as first, second, third does not represent any order, which can be simply explained as names.
Summary
[00011] The following presents a simplified summary of various aspects of this disclosure in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements nor delineate the scope of such aspects. Its purpose is to present some concepts of this disclosure in a simplified form as a prelude to the more detailed description that is presented later.
[00012] The following paragraphs provide additional support for the claims of the subject application.
[00013] The present disclosure generally relates to mounting systems. Further, the present disclosure particularly relates to a system for mounting a component onto a substrate.
[00014] An objective of the present disclosure is to provide a system that improves stability and precision in mounting a component onto a substrate. The system aims to address issues associated with alignment, vibration dampening, and real-time adjustments during the mounting process.
[00015] In an aspect, the present disclosure provides a system for mounting a component onto a substrate. The system includes a mounting head that presses said component onto said substrate and integrates embedded pressure sensors to monitor applied force. A moving unit, adjacent to the mounting head, comprises a Z-axis motor that moves the mounting head vertically. Positioned between the mounting head and Z-axis motor is a vibration-dampening unit that reduces vibrations during movement, allowing stable positioning of the mounting head in relation to the substrate.
[00016] Moreover, said system promotes continuous accuracy through the concentric alignment of the mounting head with the vibration-dampening unit, counteracting misalignments during operation. Furthermore, rotational alignment mechanisms and a radially encapsulating vibration-dampening unit enhance stability and limit lateral shifts. Anchoring the Z-axis motor to the vibration-dampening unit symmetrically distributes axial forces, ensuring even force application across the mounting head. Additionally, integration of a quick-release mechanism, feedback circuit, and real-time adjustment capabilities optimizes operational efficiency and maintains consistent force application.
[00017] The present disclosure also enables enhanced alignment integrity and responsive movement of the mounting head to accommodate varied substrate textures. Finally, multi-layered elastomeric materials within the vibration-dampening unit provide differential resistance across varied frequencies, ultimately preserving alignment and mounting accuracy throughout the process.
Brief Description of the Drawings
[00018] The features and advantages of the present disclosure would be more clearly understood from the following description taken in conjunction with the accompanying drawings in which:
[00019] FIG. 1 illustrates a system (100) for mounting a component onto a substrate, in accordance with the embodiments of the present disclosure.
[00020] FIG. 2 illustrates a sequential diagram of the system (100) for mounting a component onto a substrate, in accordance with the embodiments of the present disclosure.
Detailed Description
[00021] In the following detailed description of the invention, reference is made to the accompanying drawings that form a part hereof, and in which is shown, by way of illustration, specific embodiments in which the invention may be practiced. In the drawings, like numerals describe substantially similar components throughout the several views. These embodiments are described in sufficient detail to claim those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims and equivalents thereof.
[00022] The use of the terms "a" and "an" and "the" and "at least one" and similar referents in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. The use of the term "at least one" followed by a list of one or more items (for example, "at least one of A and B") is to be construed to mean one item selected from the listed items (A or B) or any combination of two or more of the listed items (A and B), unless otherwise indicated herein or clearly contradicted by context. The terms "comprising," "having," "including," and "containing" are to be construed as open-ended terms (i.e., meaning "including, but not limited to,") unless otherwise noted. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.
[00023] Pursuant to the "Detailed Description" section herein, whenever an element is explicitly associated with a specific numeral for the first time, such association shall be deemed consistent and applicable throughout the entirety of the "Detailed Description" section, unless otherwise expressly stated or contradicted by the context.
[00024] The present disclosure generally relates to mounting systems. Further, the present disclosure particularly relates to a system for mounting a component onto a substrate.
[00025] Pursuant to the "Detailed Description" section herein, whenever an element is explicitly associated with a specific numeral for the first time, such association shall be deemed consistent and applicable throughout the entirety of the "Detailed Description" section, unless otherwise expressly stated or contradicted by the context.
[00026] As used herein, the term "mounting head" is used to refer to a part of the system responsible for pressing a component onto a substrate. The mounting head may contain embedded pressure sensors that monitor the force applied during mounting, allowing adjustments to maintain consistent pressure on the component. Such a mounting head is utilised in situations where controlled, stable pressure is necessary to secure a component without causing misalignment or damage to the substrate. The mounting head functions to create contact between the component and the substrate, thereby facilitating the positioning and engagement required during mounting processes. Additionally, said mounting head is commonly found in applications requiring high-precision alignment, particularly where vibration and motion control are essential to achieving stability. The embedded pressure sensors in the mounting head contribute to continuous force monitoring, allowing real-time data transmission that may support various corrective actions to maintain proper pressure levels during the mounting operation.
[00027] As used herein, the term "moving unit" is used to refer to a structural element adjacent to the mounting head that provides controlled movement along a vertical axis. The moving unit may include a Z-axis motor that directs vertical displacement, enabling the mounting head to adjust height for engaging components with substrates accurately. Such a moving unit is commonly utilised to allow vertical mobility essential to performing mounting tasks on substrates positioned at different heights. The inclusion of a Z-axis motor within the moving unit allows for consistent and stable vertical movement by minimizing manual adjustments, thus contributing to controlled displacement along the vertical plane. Said moving unit serves in scenarios that require repetitive and stable vertical motion, particularly in manufacturing processes where accurate component placement is critical. The proximity of the moving unit to the mounting head allows seamless coordination between vertical movement and pressure application, essential to achieving optimal engagement between the component and the substrate.
[00028] As used herein, the term "Z-axis motor" is used to refer to an actuator within the moving unit that facilitates vertical movement of the mounting head relative to the substrate. The Z-axis motor directs the mounting head along the vertical axis, enabling precise positioning required to apply uniform pressure during the component-to-substrate engagement. Such a motor is often implemented in systems where fine vertical adjustments are necessary, particularly in assembly processes involving precise component placement. The Z-axis motor may be controlled in response to feedback, thereby providing a mechanism for maintaining consistent movement unaffected by external disturbances. Said motor operates within the moving unit framework, allowing the mounting head to achieve height adjustments in relation to varying substrate levels. By facilitating uniform vertical displacement, the Z-axis motor supports controlled movement along the vertical axis, essential in applications requiring alignment stability and consistent component positioning during mounting operations.
[00029] As used herein, the term "vibration-dampening unit" is used to refer to a part of the system that minimizes vibrations occurring during the vertical movement of the mounting head. The vibration-dampening unit is located between the mounting head and the Z-axis motor, acting as a barrier to reduce oscillatory disturbances transferred to the mounting head. Such a vibration-dampening unit is beneficial in applications that demand stable mounting conditions, as vibrations can disrupt the alignment and engagement between the component and substrate. The placement of said vibration-dampening unit between the Z-axis motor and the mounting head enables it to absorb or counteract vibrations generated from motor operations, ensuring smoother movement along the vertical axis. The vibration-dampening unit may be composed of materials or structures capable of absorbing shocks or dampening mechanical oscillations, thus aiding in reducing movement inconsistencies that would otherwise impact precision during the mounting process.
[00030] FIG. 1 illustrates a system (100) for mounting a component onto a substrate, in accordance with the embodiments of the present disclosure. In an embodiment, a mounting head 102 is included within the system 100 and configured to press a component onto a substrate. The mounting head 102 may comprise an interface that applies controlled force to the component to establish secure contact with the substrate surface. Said mounting head 102 may be designed to deliver consistent, controlled pressure, allowing for stability during component engagement with the substrate. The mounting head 102 may be fabricated from materials capable of withstanding repetitive stress and maintaining alignment under dynamic operating conditions. Embedded within the mounting head 102, a series of pressure sensors 104 may be positioned to monitor the applied force in real-time. Such pressure sensors 104 are capable of detecting variations in applied pressure and may include strain gauges, piezoelectric sensors, or other force-sensitive elements. The pressure sensors 104 may be operatively connected to a control unit within the system 100, allowing for real-time feedback to adjust pressure as needed to ensure stable contact between the component and substrate. By providing accurate data on the mounting pressure, the pressure sensors 104 allow the mounting head 102 to accommodate various substrate textures and component shapes without compromising positioning accuracy. In some applications, said mounting head 102 may include additional features to facilitate quick changes of components or to adjust the angle of approach, enhancing adaptability to various mounting requirements.
[00031] In an embodiment, the system 100 includes a moving unit 106 positioned adjacent to the mounting head 102 to enable controlled vertical movement of said mounting head 102 relative to the substrate. The moving unit 106 comprises a Z-axis motor 108 that directs the vertical displacement of the mounting head 102. Said Z-axis motor 108 may be an electric motor capable of precise incremental adjustments along the vertical axis to facilitate alignment between the component and substrate. The Z-axis motor 108 may be operatively connected to a control system to execute programmed movements, and its operational parameters may be adjusted to suit the specific requirements of the mounting process. The moving unit 106 may provide stability to the mounting head 102 by preventing unintended lateral shifts during vertical movement, aiding in accurate positioning of the mounting head 102 onto the component. The Z-axis motor 108 within the moving unit 106 may include internal feedback systems, such as encoders, to allow precise movement tracking. Said moving unit 106 may also allow adjustments to the speed of movement, enabling gradual application of force and smooth vertical displacement. In certain embodiments, the moving unit 106 may incorporate additional supports or guiding structures to enhance linearity of the Z-axis movement, thereby ensuring consistent positioning accuracy across varying mounting applications.
[00032] In an embodiment, a vibration-dampening unit 110 is provided within the system 100 and is positioned between the mounting head 102 and the Z-axis motor 108 within the moving unit 106. The vibration-dampening unit 110 is structured to absorb and minimize vibrational impact originating from the Z-axis motor 108, thereby reducing the likelihood of misalignment or instability during vertical movement. The vibration-dampening unit 110 may consist of a multi-layered elastomeric material or composite structures designed to provide differential resistance, effectively countering oscillatory forces that might disrupt stable positioning of the mounting head 102. Said vibration-dampening unit 110 is operatively positioned to isolate the mounting head 102 from vibrational influences, allowing the mounting head 102 to maintain consistent alignment with the substrate during operation. In some embodiments, the vibration-dampening unit 110 may include adjustable damping features to accommodate varying operational conditions or component types. The vibration-dampening unit 110 may work in coordination with the Z-axis motor 108 to ensure smooth, uninterrupted movement of the mounting head 102, contributing to stable engagement between the component and substrate. The unit 110 may be supported within the moving unit 106 framework, ensuring proper distribution of force while preserving linear movement along the Z-axis.
[00033] In an embodiment, the system 100 includes a mounting head 102 aligned concentrically with a vibration-dampening unit 110, enabling the vibration-dampening unit 110 to counteract misalignments during operation. The concentric configuration of the mounting head 102 relative to the vibration-dampening unit 110 enables alignment forces from the vibration-dampening unit 110 to exert a stabilising effect, effectively mitigating minor positional deviations of the mounting head 102. This alignment aids in achieving consistent engagement between the component and substrate, reducing risks associated with lateral movement or positional offset during the mounting process. The alignment may also reduce vibrational impact by distributing any vibrational forces symmetrically across the mounting head 102, thereby maintaining stability during vertical movement. In certain applications, concentric alignment facilitates uniform force distribution, which is particularly advantageous in operations where continuous accuracy is necessary. The vibration-dampening unit 110, when concentrically aligned with the mounting head 102, may also accommodate adjustments to fine-tune positioning, thereby preserving alignment integrity during repetitive mounting tasks. Additionally, the concentric configuration allows the system 100 to respond dynamically to varying force requirements while maintaining continuous stability in the engagement between the component and substrate.
[00034] In an embodiment, the system 100 incorporates a moving unit 106 that is rotationally oriented in relation to the vibration-dampening unit 110. This orientation enables a rotational alignment mechanism to enhance stability of the mounting head 102 during vertical movement. The rotational alignment mechanism facilitates movement of the mounting head 102 along the Z-axis while minimising lateral shifts, thereby stabilising the mounting head 102 during mounting. The rotational orientation of the moving unit 106 relative to the vibration-dampening unit 110 further aids in maintaining alignment of the mounting head 102 by resisting rotational displacement caused by mechanical disturbances. This orientation allows for coordinated movement between the moving unit 106 and vibration-dampening unit 110, promoting synchronised operation along the Z-axis. Such rotational orientation within the system 100 is beneficial in applications requiring high stability, as it provides additional resistance against misalignment along the vertical plane. Additionally, rotational alignment facilitates balanced force application to the mounting head 102, enhancing the mounting head's stability and precision during component engagement with the substrate.
[00035] In an embodiment, the system 100 includes a Z-axis motor 108 located within the moving unit 106 that is directly anchored to the vibration-dampening unit 110. This direct anchoring establishes a stable connection that symmetrically distributes axial forces from the Z-axis motor 108 to the mounting head 102. The anchoring configuration ensures that forces generated by the Z-axis motor 108 are transferred evenly, minimising any inconsistencies in force application that may otherwise impact the accuracy of the mounting process. By anchoring the Z-axis motor 108 to the vibration-dampening unit 110, the system 100 achieves enhanced structural stability, facilitating consistent performance in tasks requiring precise vertical alignment. The Z-axis motor 108, in conjunction with the vibration-dampening unit 110, ensures that axial forces are channelled in a manner that supports balanced engagement between the mounting head 102 and the substrate. Such an arrangement may also reduce vibrational interference from the Z-axis motor 108 by damping mechanical oscillations before they reach the mounting head 102, further stabilising the mounting operation. In applications involving repetitive or prolonged use, this anchoring configuration contributes to the durability and reliability of the system 100 by preserving consistent force dynamics across mounting cycles.
[00036] In an embodiment, the system 100 includes a vibration-dampening unit 110 that radially encapsulates the Z-axis motor 108, providing a radial alignment that constrains vibrational effects impacting the Z-axis movement of the mounting head 102. The radial encapsulation allows the vibration-dampening unit 110 to isolate the Z-axis motor 108 from external vibrations, thereby ensuring that vertical motion remains controlled and stable. This radial alignment is particularly advantageous in minimising lateral shifts or deviations that may occur during mounting operations, as it channels any vibrational forces away from the mounting head 102. By containing vibrational effects within the Z-axis motor 108, the radial configuration contributes to smoother vertical movement, supporting consistent contact between the component and substrate. Additionally, the vibration-dampening unit 110, when encapsulating the Z-axis motor 108 radially, may be constructed from materials selected for effective shock absorption, ensuring stable operation under varied mounting conditions. Such radial encapsulation is also beneficial in protecting the integrity of the Z-axis motor 108 by reducing exposure to potentially destabilising forces.
[00037] In an embodiment, the mounting head 102 comprises a coupling interface that integrates with pressure sensors 104, enabling transmission of pressure data to the Z-axis motor 108 within the moving unit 106. The coupling interface facilitates communication between the pressure sensors 104 and the Z-axis motor 108, allowing for real-time adjustments to the vertical force applied by the mounting head 102. Such a coupling interface is particularly advantageous in applications requiring accurate force modulation, as it enables the system 100 to optimise pressure application based on the substrate's properties. The pressure sensors 104 within the mounting head 102 provide continuous feedback to the Z-axis motor 108, allowing the system 100 to dynamically adjust vertical force, which is essential for maintaining stable contact during mounting. The coupling interface may further support adaptable mounting strategies by modulating force levels based on real-time data. Additionally, the coupling interface enhances the operational flexibility of the system 100 by facilitating responsive adjustments, supporting consistent engagement between the component and substrate across varying conditions.
[00038] In an embodiment, the mounting head 102 includes a quick-release mechanism positioned adjacent to the pressure sensors 104, allowing rapid detachment of the component upon reaching predefined pressure thresholds. The quick-release mechanism facilitates efficient transition between mounting operations by enabling quick disengagement from the substrate once the desired pressure level is achieved. This feature aids in reducing wear on both the component and substrate by minimising prolonged exposure to force beyond necessary limits. The quick-release mechanism may be configured to respond automatically to signals from the pressure sensors 104, ensuring timely release upon reaching preset thresholds. Such a mechanism is beneficial in high-throughput environments, where operational efficiency and reduced downtime are critical. The quick-release mechanism further aids in protecting the structural integrity of the substrate by preventing over-compression during mounting cycles. Additionally, the quick-release feature supports a streamlined mounting process by eliminating manual intervention, enhancing consistency and reliability across mounting tasks.
[00039] In an embodiment, the vibration-dampening unit 110 incorporates a multi-layered elastomeric material that provides differential resistance along both vertical and lateral axes. The elastomeric material is selected for its ability to absorb and distribute forces, thereby limiting vibrational impact across varied frequencies encountered during the vertical movement of the mounting head 102. This multi-layered structure is advantageous in maintaining alignment of the mounting head 102 relative to the substrate by minimising disturbances that may arise from vibrations during operation. The differential resistance offered by the elastomeric material within the vibration-dampening unit 110 enables effective dampening across a range of frequencies, supporting stable vertical displacement. The multi-layered design may also contribute to the durability of the vibration-dampening unit 110 by providing targeted resistance tailored to both vertical and lateral impacts, enhancing operational stability during mounting. Such a configuration is essential in applications where the mounting head 102 must maintain precise alignment under dynamic conditions, preserving reliable contact with the substrate.
[00040] In an embodiment, the Z-axis motor 108 is programmed to adjust the vertical displacement of the mounting head 102 incrementally based on resistance data received from the pressure sensors 104. This programming enables the system 100 to modulate the vertical movement of the mounting head 102 in response to varying substrate textures, preventing deviations during mounting. Incremental adjustments allow the Z-axis motor 108 to apply force in a controlled manner, accommodating substrates with diverse surface properties. The interaction between the Z-axis motor 108 and the pressure sensors 104 enables consistent positioning accuracy by maintaining responsive vertical displacement adjustments throughout the mounting operation. Such programming is beneficial in applications where fine-tuned adjustments are required to adapt to varying substrate textures, ensuring stable contact. The incremental adjustment mechanism further supports repeatable, high-precision mounting cycles, allowing the system 100 to respond effectively to subtle variations in resistance encountered during component engagement

[00041] In an embodiment, the mounting head 102 incorporates a feedback circuit that interfaces with the Z-axis motor 108, enabling continuous monitoring and adjustment of vertical force during operation. The feedback circuit transmits data regarding the applied force to the Z-axis motor 108, facilitating real-time adjustments to maintain consistent pressure on the substrate. Such a feedback circuit is essential in environments requiring high accuracy, as it supports ongoing regulation of applied force, thereby preventing component misalignment during the mounting process. The continuous monitoring provided by the feedback circuit ensures that the mounting head 102 maintains stable engagement with the substrate under dynamic operating conditions. The feedback circuit may be configured to adjust force levels automatically in response to detected variations, enhancing the reliability of the mounting process. This configuration supports consistent alignment between the component and substrate, providing adaptability to varying mounting requirements without compromising accuracy.
[00042] FIG. 2 illustrates a sequential diagram of the system (100) for mounting a component onto a substrate, in accordance with the embodiments of the present disclosure. The figure illustrates a system 100 for mounting a component onto a substrate, detailing the interaction between the mounting head 102, embedded pressure sensors 104, moving unit 106, Z-axis motor 108, and vibration-dampening unit 110. Initially, the system 100 activates the mounting head 102, which is configured to press the component onto the substrate. The embedded pressure sensors 104 within the mounting head monitor the applied force in real-time, feeding pressure data back to ensure controlled engagement. The mounting head then requests vertical alignment from the moving unit 106, which triggers the Z-axis motor 108 to initiate upward or downward movement of the mounting head. The Z-axis motor transmits force through the vibration-dampening unit 110, which stabilizes against any vibrational impact, maintaining steady vertical positioning. The mounting head 102 completes the mounting process upon proper alignment, and the system signals release, indicating successful component placement. The integrated design supports accurate, stable, and efficient mounting processes, enhancing substrate interaction through coordinated component actions.
[00043] In an embodiment, the mounting head 102 in system 100 is designed to press a component onto a substrate, where the embedded pressure sensors 104 provide continuous feedback on the applied force. This configuration allows for real-time monitoring and adjustment of the pressure, which is essential in maintaining a consistent engagement between the component and substrate. The pressure sensors 104 enable accurate force control, reducing the risk of damage to delicate components or substrates and minimizing misalignment. By embedding the sensors 104 within the mounting head 102, the system 100 can perform high-precision mounting processes that require specific force parameters, thus maintaining contact stability during operation. Additionally, the feedback from sensors 104 supports adaptive responses to variations in the substrate, allowing for optimized mounting performance across different surface textures.
[00044] In an embodiment, the mounting head 102 is aligned concentrically with the vibration-dampening unit 110, creating a structural synergy where forces from the vibration-dampening unit 110 actively counterbalance any misalignment of the mounting head 102. The concentric alignment allows the system 100 to stabilize the mounting head 102 in both static and dynamic states, enabling consistent press-fit engagement with the component and substrate. This alignment helps to prevent lateral shifts that could compromise the accuracy of the mounting operation. By directly counteracting misalignments, the concentric configuration improves positional stability during the application of pressure, enhancing overall mounting accuracy and reducing the likelihood of wear on both the component and substrate. The vibration-dampening unit 110, in this configuration, not only mitigates vibrational impact but also serves as a corrective mechanism for alignment deviations.
[00045] In an embodiment, the moving unit 106 is rotationally oriented with respect to the vibration-dampening unit 110, facilitating a rotational alignment mechanism that stabilizes the vertical movement of the mounting head 102. This rotational orientation minimizes lateral shifts, allowing for smoother and more controlled Z-axis motion. By aligning the moving unit 106 and vibration-dampening unit 110 in this way, the system 100 achieves greater stability in the vertical movement of the mounting head 102. This arrangement limits unwanted side-to-side motion that could affect the precision of component placement. The rotational alignment mechanism also helps to distribute forces more evenly, thereby enhancing the overall robustness of the mounting operation, especially in applications where exact positioning is required over multiple cycles.
[00046] In an embodiment, the Z-axis motor 108 is directly anchored to the vibration-dampening unit 110, resulting in symmetrical distribution of axial forces to the mounting head 102. This direct anchoring promotes balanced force application across the mounting head 102, allowing for uniform contact with the substrate. The symmetrical force distribution mitigates localized stress on specific points of the mounting head 102, thus preventing potential deformation or misalignment. By anchoring the Z-axis motor 108 in this manner, the system 100 achieves consistent force transmission through the vibration-dampening unit 110, which supports the durability and accuracy of the mounting process. This configuration enhances reliability in mounting operations, especially where precise vertical alignment and consistent force application are critical to achieving stable engagement between the component and substrate.
[00047] In an embodiment, the vibration-dampening unit 110 radially encapsulates the Z-axis motor 108, creating a radial alignment that effectively constrains vibrational effects along the Z-axis movement of the mounting head 102. By encapsulating the motor in this radial configuration, the vibration-dampening unit 110 isolates the mounting head 102 from external vibrations that could disrupt alignment. This setup ensures that vertical motion remains controlled, reducing any tendency for lateral drift during mounting operations. The radial encapsulation also serves to protect the Z-axis motor 108 from vibrational stresses, thereby promoting smoother operation and contributing to the longevity of the motor and mounting head 102 assembly. The encapsulation improves stability during high-precision operations, maintaining alignment integrity between the component and substrate throughout the mounting process.
[00048] In an embodiment, the mounting head 102 includes a coupling interface integrated with pressure sensors 104, enabling the transmission of pressure data to the Z-axis motor 108 within the moving unit 106. The coupling interface facilitates real-time data communication, allowing the Z-axis motor 108 to adjust the applied force based on live feedback from the pressure sensors 104. This interaction optimizes contact between the component and substrate, as the system 100 can adapt force levels dynamically to account for changes in substrate characteristics. The coupling interface promotes precision by aligning the applied force with real-time data, which is essential in applications where stable contact must be maintained to prevent misalignment or component damage. The ability to respond to pressure variations supports consistent and reliable mounting across diverse operational conditions.
[00049] In an embodiment, the mounting head 102 is equipped with a quick-release mechanism adjacent to the pressure sensors 104, allowing rapid detachment of the component upon reaching predefined pressure thresholds. The quick-release mechanism improves operational efficiency by enabling fast transitions between mounting cycles, reducing downtime associated with manual component handling. By disengaging the component when the desired pressure is achieved, the system 100 prevents over-compression, protecting both the component and substrate from potential wear or damage. The quick-release mechanism also enhances safety by ensuring that excessive force is not applied beyond the required threshold, thus preserving the integrity of the assembly. This feature is particularly useful in high-volume production settings where rapid, automated processes are beneficial.
[00050] In an embodiment, the vibration-dampening unit 110 incorporates a multi-layered elastomeric material that provides differential resistance along both vertical and lateral axes, effectively limiting vibrational impact across varied frequencies. The multi-layered structure allows the vibration-dampening unit 110 to absorb a wide range of vibrational energies, ensuring that both high- and low-frequency disturbances are mitigated. This differential resistance is advantageous in maintaining alignment of the mounting head 102, as it counteracts vibrational forces that may otherwise lead to positional drift. The elastomeric material also enhances durability by providing targeted resistance, supporting stable operation even under challenging conditions. The ability to dampen vibrations in multiple axes helps the system 100 maintain reliable alignment with the substrate, promoting consistent engagement throughout the mounting process.
[00051] In an embodiment, the Z-axis motor 108 is programmed to make incremental adjustments to the vertical displacement of the mounting head 102 based on resistance data from the pressure sensors 104. This programming allows for controlled movement of the mounting head 102, adapting to variable substrate textures without deviating from the intended mounting path. Incremental adjustments ensure that the applied force remains consistent, even when encountering irregular or textured surfaces on the substrate. This responsiveness allows the system 100 to maintain stable contact with the substrate, reducing the likelihood of misalignment or component shifting during mounting. Such adaptive vertical displacement is valuable in applications requiring fine control over positioning accuracy and force distribution.
[00052] In an embodiment, the mounting head 102 includes a feedback circuit connected to the Z-axis motor 108, enabling continuous monitoring and adjustment of vertical force during operation. The feedback circuit provides real-time data to the Z-axis motor 108, which allows for immediate modifications to the applied force as required. This continuous feedback loop enhances mounting accuracy by ensuring that the mounting head 102 maintains consistent pressure on the substrate. By monitoring force levels dynamically, the feedback circuit helps prevent potential misalignments or excessive force applications, which could affect the mounting quality. The feedback circuit's ability to adjust force application on the fly supports high-precision mounting tasks where consistent force application is critical to achieving reliable and repeatable results.
[00053] Example embodiments herein have been described above with reference to block diagrams and flowchart illustrations of methods and apparatuses. It will be understood that each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, respectively, can be implemented by various means including hardware, software, firmware, and a combination thereof. For example, in one embodiment, each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations can be implemented by computer program instructions. These computer program instructions may be loaded onto a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions which execute on the computer or other programmable data processing apparatus create means for implementing the functions specified in the flowchart block or blocks.
[00054] Throughout the present disclosure, the term 'Artificial intelligence (AI)' as used herein relates to any mechanism or computationally intelligent system that combines knowledge, techniques, and methodologies for controlling a bot or other element within a computing environment. Furthermore, the artificial intelligence (AI) is configured to apply knowledge and that can adapt it-self and learn to do better in changing environments. Additionally, employing any computationally intelligent technique, the artificial intelligence (AI) is operable to adapt to unknown or changing environment for better performance. The artificial intelligence (AI) includes fuzzy logic engines, decision-making engines, preset targeting accuracy levels, and/or programmatically intelligent software.
[00055] Throughout the present disclosure, the term 'processing means' or 'microprocessor' or 'processor' or 'processors' includes, but is not limited to, a general purpose processor (such as, for example, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a microprocessor implementing other types of instruction sets, or a microprocessor implementing a combination of types of instruction sets) or a specialized processor (such as, for example, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), or a network processor).
[00056] The term "non-transitory storage device" or "storage" or "memory," as used herein relates to a random access memory, read only memory and variants thereof, in which a computer can store data or software for any duration.
[00057] Operations in accordance with a variety of aspects of the disclosure is described above would not have to be performed in the precise order described. Rather, various steps can be handled in reverse order or simultaneously or not at all.
[00058] While several implementations have been described and illustrated herein, a variety of other means and/or structures for performing the function and/or obtaining the results and/or one or more of the advantages described herein may be utilized, and each of such variations and/or modifications is deemed to be within the scope of the implementations described herein. More generally, all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the teachings is/are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific implementations described herein. It is, therefore, to be understood that the foregoing implementations are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, implementations may be practiced otherwise than as specifically described and claimed. Implementations of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein. In addition, any combination of two or more such features, systems, articles, materials, kits, and/or methods, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, is included within the scope of the present disclosure.













Claims
I/We Claim:
1. A system (100) for mounting a component onto a substrate, comprising:
a mounting head (102) configured to press said component onto said substrate, said mounting head (102) having embedded pressure sensors (104);
a moving unit (106) positioned adjacent to said mounting head (102), said moving unit (106) comprising a Z-axis motor (108) configured to move said mounting head (102) along a vertical axis; and
a vibration-dampening unit (110) positioned between said mounting head (102) and said Z-axis motor (108), said vibration-dampening unit (110) configured to reduce vibrations during movement of said mounting head (102), wherein said vibration-dampening unit (110) allows for precise positioning of said mounting head (102) in relation to said substrate.
Claim 2:
The system (100) of claim 1, wherein said mounting head (102) is aligned in a concentric configuration with said vibration-dampening unit (110) such that alignment forces from said vibration-dampening unit (110) directly counteract misalignments of said mounting head (102) during operation, ensuring continuous precision in the press-fit engagement between said component and said substrate.
Claim 3:
The system (100) of claim 1, wherein said moving unit (106) is rotationally oriented with respect to said vibration-dampening unit (110) to facilitate a rotational alignment mechanism, whereby vertical movement of said mounting head (102) remains stabilized by said vibration-dampening unit (110), enhancing stability in the Z-axis movement and limiting lateral shifts during operation.
Claim 4:
The system (100) of claim 1, wherein said Z-axis motor (108) within said moving unit (106) is directly anchored to said vibration-dampening unit (110), such that axial forces from said Z-axis motor (108) are symmetrically distributed through said vibration-dampening unit (110) to said mounting head (102), thereby promoting consistent force application across said mounting head (102) for improved accuracy during mounting processes.
Claim 5:
The system (100) of claim 1, wherein said vibration-dampening unit (110) is radially encapsulating said Z-axis motor (108), thereby establishing a radial alignment that constrains vibrational effects along the Z-axis movement of said mounting head (102), ensuring that vertical motion remains precisely controlled for optimal substrate interaction.
Claim 6:
The system (100) of claim 1, wherein said mounting head (102) comprises a coupling interface integrated with said pressure sensors (104), such that pressure data from said sensors (104) is transmitted to said Z-axis motor (108) within said moving unit (106), allowing real-time adjustments in vertical force applied, thereby optimizing contact between said component and said substrate.
Claim 7:
The system (100) of claim 1, wherein said mounting head (102) is further equipped with a quick-release mechanism operatively adjacent to said pressure sensors (104), enabling rapid detachment of said component from said mounting head (102) upon reaching predefined pressure thresholds, thereby enhancing operational efficiency and reducing wear on said substrate.
Claim 8:
The system (100) of claim 1, wherein said vibration-dampening unit (110) incorporates a multi-layered elastomeric material configured to provide differential resistance along both vertical and lateral axes, thereby limiting vibrational impact across varied frequencies during the vertical travel of said mounting head (102), ultimately preserving alignment integrity of said mounting head (102) with respect to said substrate.
Claim 9:
The system (100) of claim 1, wherein said Z-axis motor (108) is programmed to incrementally adjust the vertical displacement of said mounting head (102) in response to resistance data from said pressure sensors (104), thus ensuring controlled and responsive movement of said mounting head (102) to accommodate variable substrate textures without deviation.
Claim 10:
The system (100) of claim 1, wherein said mounting head (102) further includes a feedback circuit operatively in connection with said Z-axis motor (108), enabling continuous monitoring and adjustment of vertical force application during operation, thereby enhancing mounting accuracy and reducing potential for component misalignment on said substrate.




Dated 11 November 2024 Jigneshbhai Mungalpara
IN/PA- 2640
Agent for the Applicant



Mounting Apparatus with Pressure Sensors and Vibration-Dampening for Component Alignment
Abstract
The present disclosure provides a system for mounting a component onto a substrate. The system includes a mounting head that presses said component onto said substrate. The mounting head comprises embedded pressure sensors that facilitate real-time monitoring. A moving unit positioned adjacent to the mounting head includes a Z-axis motor that moves the mounting head along a vertical axis. A vibration-dampening unit is positioned between the mounting head and the Z-axis motor. The vibration-dampening unit reduces vibrations during movement of the mounting head, thereby allowing precise positioning of the mounting head in relation to the substrate.


Dated 11 November 2024 Jigneshbhai Mungalpara
IN/PA- 2640
Agent for the Applicant

, Claims:Claims
I/We Claim:
1. A system (100) for mounting a component onto a substrate, comprising:
a mounting head (102) configured to press said component onto said substrate, said mounting head (102) having embedded pressure sensors (104);
a moving unit (106) positioned adjacent to said mounting head (102), said moving unit (106) comprising a Z-axis motor (108) configured to move said mounting head (102) along a vertical axis; and
a vibration-dampening unit (110) positioned between said mounting head (102) and said Z-axis motor (108), said vibration-dampening unit (110) configured to reduce vibrations during movement of said mounting head (102), wherein said vibration-dampening unit (110) allows for precise positioning of said mounting head (102) in relation to said substrate.
Claim 2:
The system (100) of claim 1, wherein said mounting head (102) is aligned in a concentric configuration with said vibration-dampening unit (110) such that alignment forces from said vibration-dampening unit (110) directly counteract misalignments of said mounting head (102) during operation, ensuring continuous precision in the press-fit engagement between said component and said substrate.
Claim 3:
The system (100) of claim 1, wherein said moving unit (106) is rotationally oriented with respect to said vibration-dampening unit (110) to facilitate a rotational alignment mechanism, whereby vertical movement of said mounting head (102) remains stabilized by said vibration-dampening unit (110), enhancing stability in the Z-axis movement and limiting lateral shifts during operation.
Claim 4:
The system (100) of claim 1, wherein said Z-axis motor (108) within said moving unit (106) is directly anchored to said vibration-dampening unit (110), such that axial forces from said Z-axis motor (108) are symmetrically distributed through said vibration-dampening unit (110) to said mounting head (102), thereby promoting consistent force application across said mounting head (102) for improved accuracy during mounting processes.
Claim 5:
The system (100) of claim 1, wherein said vibration-dampening unit (110) is radially encapsulating said Z-axis motor (108), thereby establishing a radial alignment that constrains vibrational effects along the Z-axis movement of said mounting head (102), ensuring that vertical motion remains precisely controlled for optimal substrate interaction.
Claim 6:
The system (100) of claim 1, wherein said mounting head (102) comprises a coupling interface integrated with said pressure sensors (104), such that pressure data from said sensors (104) is transmitted to said Z-axis motor (108) within said moving unit (106), allowing real-time adjustments in vertical force applied, thereby optimizing contact between said component and said substrate.
Claim 7:
The system (100) of claim 1, wherein said mounting head (102) is further equipped with a quick-release mechanism operatively adjacent to said pressure sensors (104), enabling rapid detachment of said component from said mounting head (102) upon reaching predefined pressure thresholds, thereby enhancing operational efficiency and reducing wear on said substrate.
Claim 8:
The system (100) of claim 1, wherein said vibration-dampening unit (110) incorporates a multi-layered elastomeric material configured to provide differential resistance along both vertical and lateral axes, thereby limiting vibrational impact across varied frequencies during the vertical travel of said mounting head (102), ultimately preserving alignment integrity of said mounting head (102) with respect to said substrate.
Claim 9:
The system (100) of claim 1, wherein said Z-axis motor (108) is programmed to incrementally adjust the vertical displacement of said mounting head (102) in response to resistance data from said pressure sensors (104), thus ensuring controlled and responsive movement of said mounting head (102) to accommodate variable substrate textures without deviation.
Claim 10:
The system (100) of claim 1, wherein said mounting head (102) further includes a feedback circuit operatively in connection with said Z-axis motor (108), enabling continuous monitoring and adjustment of vertical force application during operation, thereby enhancing mounting accuracy and reducing potential for component misalignment on said substrate.




Dated 11 November 2024 Jigneshbhai Mungalpara
IN/PA- 2640
Agent for the Applicant

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