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MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER
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Abstract
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MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER
PCT NATIONAL PHASE APPLICATION
Published
Filed on 6 October 2022
Patent Information
| Application ID | 202217057211 |
| Date of Application | 06/10/2022 |
Documents
| Name | Date |
|---|---|
| 202217057211-FORM 3 [25-03-2023(online)].pdf | 25/03/2023 |
| 202217057211-FORM-26 [07-10-2022(online)].pdf | 07/10/2022 |
| 202217057211-CLAIMS UNDER RULE 1 (PROVISIO) OF RULE 20 [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-COMPLETE SPECIFICATION [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-DECLARATION OF INVENTORSHIP (FORM 5) [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-DRAWINGS [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-FORM 1 [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-PROOF OF RIGHT [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-STATEMENT OF UNDERTAKING (FORM 3) [06-10-2022(online)].pdf | 06/10/2022 |
| 202217057211-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [06-10-2022(online)].pdf | 06/10/2022 |
