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MICROWAVE INTEGRATED CIRCUITS (MIC’S) WITH SURFACE MOUNT HIGH POWER ELECTRONIC DEVICES ON COMPOSITE MULTILAYER PRINTED CIRCUIT BOARD
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Abstract
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MICROWAVE INTEGRATED CIRCUITS (MIC’S) WITH SURFACE MOUNT HIGH POWER ELECTRONIC DEVICES ON COMPOSITE MULTILAYER PRINTED CIRCUIT BOARD
ORDINARY APPLICATION
Published
Filed on 25 March 2021
Patent Information
| Application ID | 202141013139 |
| Date of Application | 25/03/2021 |
Documents
| Name | Date |
|---|---|
| 202141013139-Proof of Right [15-07-2021(online)].pdf | 15/07/2021 |
| 202141013139-COMPLETE SPECIFICATION [25-03-2021(online)].pdf | 25/03/2021 |
| 202141013139-DECLARATION OF INVENTORSHIP (FORM 5) [25-03-2021(online)].pdf | 25/03/2021 |
| 202141013139-DRAWINGS [25-03-2021(online)].pdf | 25/03/2021 |
| 202141013139-FORM 1 [25-03-2021(online)].pdf | 25/03/2021 |
| 202141013139-POWER OF AUTHORITY [25-03-2021(online)].pdf | 25/03/2021 |
