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MICROELECTRONIC PACKAGE WITH THREE-DIMENSIONAL (3D) MONOLITHIC MEMORY DIE
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Abstract
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MICROELECTRONIC PACKAGE WITH THREE-DIMENSIONAL (3D) MONOLITHIC MEMORY DIE
CONVENTIONAL APPLICATION
Published
Filed on 10 December 2020
Patent Information
| Application ID | 202044053670 |
| Date of Application | 10/12/2020 |
Documents
| Name | Date |
|---|---|
| 202044053670-FORM 3 [10-12-2021(online)].pdf | 10/12/2021 |
| 202044053670-FORM 3 [08-06-2021(online)].pdf | 08/06/2021 |
| 202044053670-FORM-26 [27-02-2021(online)].pdf | 27/02/2021 |
| 202044053670-COMPLETE SPECIFICATION [10-12-2020(online)].pdf | 10/12/2020 |
| 202044053670-DECLARATION OF INVENTORSHIP (FORM 5) [10-12-2020(online)].pdf | 10/12/2020 |
| 202044053670-DRAWINGS [10-12-2020(online)].pdf | 10/12/2020 |
