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“MICROELECTRONIC PACKAGE CONTAINING SILICON PATCHES FOR HIGH DENSITY INTERCONNECTS, AND METHOD OF MANUFACTURING SAME”

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“MICROELECTRONIC PACKAGE CONTAINING SILICON PATCHES FOR HIGH DENSITY INTERCONNECTS, AND METHOD OF MANUFACTURING SAME”

DIVISIONAL PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 6 April 2021

Patent Information

Application ID202118016148
Date of Application06/04/2021

Documents

NameDate
202118016148-AMMENDED DOCUMENTS [21-12-2022(online)].pdf21/12/2022
202118016148-Annexure [21-12-2022(online)].pdf21/12/2022
202118016148-CLAIMS [21-12-2022(online)].pdf21/12/2022
202118016148-FER_SER_REPLY [21-12-2022(online)].pdf21/12/2022
202118016148-FORM 13 [21-12-2022(online)].pdf21/12/2022
202118016148-MARKED COPIES OF AMENDEMENTS [21-12-2022(online)].pdf21/12/2022
202118016148-OTHERS [21-12-2022(online)].pdf21/12/2022
202118016148-FORM 3 [24-11-2022(online)].pdf24/11/2022
202118016148-FORM 4(ii) [24-11-2022(online)].pdf24/11/2022
202118016148-FER.pdf24/05/2022
202118016148-Correspondence Others-210921.pdf19/10/2021
202118016148-FORM 13 [19-10-2021(online)].pdf19/10/2021
202118016148-GPA-210921.pdf19/10/2021
202118016148-FORM-26 [30-07-2021(online)].pdf30/07/2021
202118016148-COMPLETE SPECIFICATION [06-04-2021(online)].pdf06/04/2021
202118016148-DECLARATION OF INVENTORSHIP (FORM 5) [06-04-2021(online)].pdf06/04/2021
202118016148-DRAWINGS [06-04-2021(online)].pdf06/04/2021
202118016148-FIGURE OF ABSTRACT [06-04-2021(online)].pdf06/04/2021
202118016148-FORM 1 [06-04-2021(online)].pdf06/04/2021
202118016148-FORM 18 [06-04-2021(online)].pdf06/04/2021
202118016148-PRIORITY DOCUMENTS [06-04-2021(online)].pdf06/04/2021
202118016148-REQUEST FOR EXAMINATION (FORM-18) [06-04-2021(online)].pdf06/04/2021
202118016148-STATEMENT OF UNDERTAKING (FORM 3) [06-04-2021(online)].pdf06/04/2021
202118016148-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [06-04-2021(online)].pdf06/04/2021

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