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MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION
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Abstract
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MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION
PCT NATIONAL PHASE APPLICATION
Published
Filed on 13 February 2017
Patent Information
| Application ID | 201747005092 |
| Date of Application | 13/02/2017 |
Documents
| Name | Date |
|---|---|
| 201747005092-FER.pdf | 17/03/2020 |
| 201747005092-FORM 18 [12-09-2018(online)].pdf | 12/09/2018 |
| Correspondence by Agent_Assignment_04-08-2017.pdf | 04/08/2017 |
| 201747005092-Proof of Right (MANDATORY) [01-08-2017(online)].pdf | 01/08/2017 |
| 201747005092-FORM 3 [24-07-2017(online)].pdf | 24/07/2017 |
| abstract 201747005092.jpg | 27/05/2017 |
| Correspondence by Agent_Attested GPA_27-02-2017.pdf | 27/02/2017 |
| 201747005092.pdf | 20/02/2017 |
| Description(Complete) [13-02-2017(online)].pdf | 13/02/2017 |
| Description(Complete) [13-02-2017(online)].pdf_263.pdf | 13/02/2017 |
| Drawing [13-02-2017(online)].pdf | 13/02/2017 |
| Form 3 [13-02-2017(online)].pdf | 13/02/2017 |
| Form 5 [13-02-2017(online)].pdf | 13/02/2017 |
| Power of Attorney [13-02-2017(online)].pdf | 13/02/2017 |
| Priority Document [13-02-2017(online)].pdf | 13/02/2017 |
