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METHOD AND DEVICE FOR REALIZING ETCHING AND POLISHING OF SILICON WAFER WITH ALKALINE SYSTEM BY USING OZONE
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Abstract
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METHOD AND DEVICE FOR REALIZING ETCHING AND POLISHING OF SILICON WAFER WITH ALKALINE SYSTEM BY USING OZONE
PCT NATIONAL PHASE APPLICATION
Published
Filed on 23 December 2020
Patent Information
| Application ID | 202027056029 |
| Date of Application | 23/12/2020 |
Documents
| Name | Date |
|---|---|
| 202027056029-CLAIMS [21-05-2022(online)].pdf | 21/05/2022 |
| 202027056029-DRAWING [21-05-2022(online)].pdf | 21/05/2022 |
| 202027056029-FER_SER_REPLY [21-05-2022(online)].pdf | 21/05/2022 |
| 202027056029-FER.pdf | 30/12/2021 |
| 202027056029.pdf | 19/10/2021 |
| Abstract.jpg | 19/10/2021 |
| 202027056029-COMPLETE SPECIFICATION [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-DECLARATION OF INVENTORSHIP (FORM 5) [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-DRAWINGS [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-FIGURE OF ABSTRACT [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-FORM 1 [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-FORM 18 [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-POWER OF AUTHORITY [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-PRIORITY DOCUMENTS [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-PROOF OF RIGHT [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-REQUEST FOR EXAMINATION (FORM-18) [23-12-2020(online)].pdf | 23/12/2020 |
| 202027056029-STATEMENT OF UNDERTAKING (FORM 3) [23-12-2020(online)].pdf | 23/12/2020 |
