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METHOD AND APPARATUS FOR WAFER LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES
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METHOD AND APPARATUS FOR WAFER LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES
PCT NATIONAL PHASE APPLICATION
Published
Filed on 1 May 2014
Patent Information
| Application ID | 3312/CHENP/2014 |
| Date of Application | 01/05/2014 |
Documents
| Name | Date |
|---|---|
| 3312-CHENP-2014-AbandonedLetter.pdf | 16/07/2018 |
| 3312-CHENP-2014-FER.pdf | 08/01/2018 |
| abstract 3312-CHENP-2014.jpg | 27/01/2015 |
| 3312-CHENP-2014 CORRESPONDENCE OTHERS 20-10-2014.pdf | 20/10/2014 |
| 304_201405011539.pdf | 02/05/2014 |
| 3312-CHENP-2014.pdf | 02/05/2014 |
| f3_201405011539.pdf | 02/05/2014 |
| f5_201405011538.pdf | 02/05/2014 |
| gpa_201405011539.pdf | 02/05/2014 |
| other_201405011540.pdf | 02/05/2014 |
| spec_201405011540.pdf | 02/05/2014 |
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