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LID-SPOUT ASSEMBLY FOR A PACKAGE AND PACKAGE HAVING A LID-SPOUT ASSEMBLY
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Abstract
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LID-SPOUT ASSEMBLY FOR A PACKAGE AND PACKAGE HAVING A LID-SPOUT ASSEMBLY
PCT NATIONAL PHASE APPLICATION
Published
Filed on 12 June 2023
Patent Information
| Application ID | 202347040025 |
| Date of Application | 12/06/2023 |
Documents
| Name | Date |
|---|---|
| 202347040025-FORM 3 [10-11-2023(online)].pdf | 10/11/2023 |
| 202347040025-FORM-26 [01-08-2023(online)].pdf | 01/08/2023 |
| 202347040025.pdf | 18/06/2023 |
| 202347040025-COMPLETE SPECIFICATION [12-06-2023(online)].pdf | 12/06/2023 |
| 202347040025-DECLARATION OF INVENTORSHIP (FORM 5) [12-06-2023(online)].pdf | 12/06/2023 |
| 202347040025-DRAWINGS [12-06-2023(online)].pdf | 12/06/2023 |
| 202347040025-FORM 1 [12-06-2023(online)].pdf | 12/06/2023 |
| 202347040025-PRIORITY DOCUMENTS [12-06-2023(online)].pdf | 12/06/2023 |
| 202347040025-PROOF OF RIGHT [12-06-2023(online)].pdf | 12/06/2023 |
