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LID-SPOUT ASSEMBLY FOR A PACKAGE, PACKAGE HAVING A LID-SPOUT ASSEMBLY AND METHOD FOR MOLDING A LID-SPOUT ASSEMBLY
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LID-SPOUT ASSEMBLY FOR A PACKAGE, PACKAGE HAVING A LID-SPOUT ASSEMBLY AND METHOD FOR MOLDING A LID-SPOUT ASSEMBLY
PCT NATIONAL PHASE APPLICATION
Published
Filed on 6 December 2022
Patent Information
| Application ID | 202247070230 |
| Date of Application | 06/12/2022 |
Documents
| Name | Date |
|---|---|
| 202247070230-FORM 3 [08-05-2023(online)].pdf | 08/05/2023 |
| 202247070230-Correspondence_Form 26 And Assignment_20-01-2023.pdf | 20/01/2023 |
| 202247070230.pdf | 25/12/2022 |
| 202247070230-FORM-26 [11-12-2022(online)].pdf | 11/12/2022 |
| 202247070230-COMPLETE SPECIFICATION [06-12-2022(online)].pdf | 06/12/2022 |
| 202247070230-DECLARATION OF INVENTORSHIP (FORM 5) [06-12-2022(online)].pdf | 06/12/2022 |
| 202247070230-DRAWINGS [06-12-2022(online)].pdf | 06/12/2022 |
| 202247070230-FORM 1 [06-12-2022(online)].pdf | 06/12/2022 |
| 202247070230-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [06-12-2022(online)].pdf | 06/12/2022 |
| 202247070230-PRIORITY DOCUMENTS [06-12-2022(online)].pdf | 06/12/2022 |
| 202247070230-PROOF OF RIGHT [06-12-2022(online)].pdf | 06/12/2022 |
