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INTEGRATED ELECTRONICS MODULE WITH COOLING STRUCTURE
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Abstract
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INTEGRATED ELECTRONICS MODULE WITH COOLING STRUCTURE
PCT NATIONAL PHASE APPLICATION
Published
Filed on 27 October 2014
Patent Information
| Application ID | 7885/CHENP/2014 |
| Date of Application | 27/10/2014 |
Documents
| Name | Date |
|---|---|
| 7885-CHENP-2014-AbandonedLetter.pdf | 03/03/2020 |
| 7885-CHENP-2014-FER.pdf | 29/08/2019 |
| abstract 7885-CHENP-2014.jpg | 02/04/2015 |
| 2011p02613wo_spec.pdf | 28/10/2014 |
| FORM 3.pdf | 28/10/2014 |
| FORM 5.pdf | 28/10/2014 |
| pr document.pdf | 28/10/2014 |
| GPOA 31-07-2013.PDF.pdf | 31/07/2013 |
