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INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS

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INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 19 December 2014

Patent Information

Application ID10923/DELNP/2014
Date of Application19/12/2014

Documents

NameDate
10923-DELNP-2014-IntimationOfGrant10-10-2023.pdf10/10/2023
10923-DELNP-2014-PatentCertificate10-10-2023.pdf10/10/2023
10923-DELNP-2014-ABSTRACT [24-02-2020(online)].pdf24/02/2020
10923-DELNP-2014-CLAIMS [24-02-2020(online)].pdf24/02/2020
10923-DELNP-2014-COMPLETE SPECIFICATION [24-02-2020(online)].pdf24/02/2020
10923-DELNP-2014-DRAWING [24-02-2020(online)].pdf24/02/2020
10923-DELNP-2014-FER_SER_REPLY [24-02-2020(online)].pdf24/02/2020
10923-DELNP-2014-OTHERS [24-02-2020(online)].pdf24/02/2020
10923-DELNP-2014-FER.pdf27/08/2019
10923-DELNP-2014 Form 1.pdf17/08/2019
Description(Complete) [18-03-2017(online)].pdf18/03/2017
Description(Complete) [18-03-2017(online)].pdf_236.pdf18/03/2017
Form 13 [18-03-2017(online)].pdf18/03/2017
Marked Copy [18-03-2017(online)].pdf18/03/2017
Form 18 [22-06-2016(online)].pdf22/06/2016
10923-delnp-2014-Correspondence-Others-(04-06-2015).pdf04/06/2015
10923-delnp-2014-Form-1-(04-06-2015).pdf04/06/2015
10923-DELNP-2014.pdf16/01/2015
ADVANCED MICRO DEVICES, INC.GPOA.pdf23/12/2014
PD014965IN-NP - FORM 3.pdf23/12/2014
PD014965IN-NP - FORM 5.pdf23/12/2014
PD014965IN-NP - SPEC for FILING.pdf23/12/2014
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