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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PACKAGE SUBSTRATE WITH DIE REGION SPLIT, AND RELATED FABRICATION METHODS
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Abstract
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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PACKAGE SUBSTRATE WITH DIE REGION SPLIT, AND RELATED FABRICATION METHODS
PCT NATIONAL PHASE APPLICATION
Published
Filed on 13 July 2022
Patent Information
| Application ID | 202247040168 |
| Date of Application | 13/07/2022 |
Documents
| Name | Date |
|---|---|
| 202247040168-FORM 3 [03-01-2023(online)].pdf | 03/01/2023 |
| 202247040168-Proof of Right [01-08-2022(online)].pdf | 01/08/2022 |
| 202247040168-COMPLETE SPECIFICATION [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-DECLARATION OF INVENTORSHIP (FORM 5) [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-DRAWINGS [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-FORM 1 [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-POWER OF AUTHORITY [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-PRIORITY DOCUMENTS [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-STATEMENT OF UNDERTAKING (FORM 3) [13-07-2022(online)].pdf | 13/07/2022 |
| 202247040168-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [13-07-2022(online)].pdf | 13/07/2022 |
