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INTEGRATED CIRCUITS (ICS) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS AND IC PACKAGES INCLUDING HIGH DENSITY DIE-TO-DIE (D2D) INTERCONNECTS
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Abstract
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INTEGRATED CIRCUITS (ICS) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS AND IC PACKAGES INCLUDING HIGH DENSITY DIE-TO-DIE (D2D) INTERCONNECTS
PCT NATIONAL PHASE APPLICATION
Published
Filed on 13 June 2023
Patent Information
| Application ID | 202347040227 |
| Date of Application | 13/06/2023 |
Documents
| Name | Date |
|---|---|
| 202347040227-FORM 3 [04-12-2023(online)].pdf | 04/12/2023 |
| 202347040227-Proof of Right [03-08-2023(online)].pdf | 03/08/2023 |
| 202347040227-COMPLETE SPECIFICATION [13-06-2023(online)].pdf | 13/06/2023 |
| 202347040227-DECLARATION OF INVENTORSHIP (FORM 5) [13-06-2023(online)].pdf | 13/06/2023 |
| 202347040227-DRAWINGS [13-06-2023(online)].pdf | 13/06/2023 |
| 202347040227-FORM 1 [13-06-2023(online)].pdf | 13/06/2023 |
| 202347040227-POWER OF AUTHORITY [13-06-2023(online)].pdf | 13/06/2023 |
| 202347040227-PRIORITY DOCUMENTS [13-06-2023(online)].pdf | 13/06/2023 |
| 202347040227-STATEMENT OF UNDERTAKING (FORM 3) [13-06-2023(online)].pdf | 13/06/2023 |
