INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS

Abstract

Inductor packages employing wire-bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods. The inductor package includes one or more integrated inductors each formed from leads of a lead frame coupled together in a pattern through wire bonds to foil a coil(s). An overmold material is formed over the lead frame with the coil(s) formed from the wire-bonded leads to form the inductor package. The overmold material can include a magnetic material to further increase the inductance of the integrated inductor(s). The inductor package can be mounted to a package substrate of an IC package to provide an inductor(s) for a circuit in the IC package. By using a lead frame to form an inductor package, fabrication processes used to form lead frames can also be used to form the inductor package as a less complex, lower cost manufacturing method.

Documents