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IMMERSIVE COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS AND METHOD OF USING THE SAME

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IMMERSIVE COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS AND METHOD OF USING THE SAME

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 20 July 2023

Patent Information

Application ID202327048949
Date of Application20/07/2023

Documents

NameDate
202327048949-FORM 3 [03-01-2024(online)].pdf03/01/2024
Abstract1.jpg15/12/2023
202327048949-Correspondence-Letter [02-08-2023(online)].pdf02/08/2023
202327048949-Proof of Right [01-08-2023(online)].pdf01/08/2023
202327048949-FORM-26 [28-07-2023(online)].pdf28/07/2023
202327048949-COMPLETE SPECIFICATION [20-07-2023(online)].pdf20/07/2023
202327048949-DECLARATION OF INVENTORSHIP (FORM 5) [20-07-2023(online)].pdf20/07/2023
202327048949-DRAWINGS [20-07-2023(online)].pdf20/07/2023
202327048949-FIGURE OF ABSTRACT [20-07-2023(online)].pdf20/07/2023
202327048949-FORM 1 [20-07-2023(online)].pdf20/07/2023
202327048949-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [20-07-2023(online)].pdf20/07/2023
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