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IMMERSION COOLING SYSTEMS FOR ELECTRONIC COMPONENTS
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Abstract
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IMMERSION COOLING SYSTEMS FOR ELECTRONIC COMPONENTS
CONVENTIONAL APPLICATION
Published
Filed on 25 March 2022
Patent Information
| Application ID | 202214017146 |
| Date of Application | 25/03/2022 |
Documents
| Name | Date |
|---|---|
| 202214017146-FORM 3 [03-03-2023(online)].pdf | 03/03/2023 |
| 202214017146-FORM 3 [14-09-2022(online)].pdf | 14/09/2022 |
| 202214017146-FORM 3 [05-09-2022(online)].pdf | 05/09/2022 |
| 202214017146-Proof of Right [09-05-2022(online)].pdf | 09/05/2022 |
| 202214017146-COMPLETE SPECIFICATION [25-03-2022(online)].pdf | 25/03/2022 |
| 202214017146-DECLARATION OF INVENTORSHIP (FORM 5) [25-03-2022(online)].pdf | 25/03/2022 |
| 202214017146-DRAWINGS [25-03-2022(online)].pdf | 25/03/2022 |
| 202214017146-EP 21305427-DASCODE-338C [25-03-2022].pdf | 25/03/2022 |
| 202214017146-EP 21306172-DASCODE-5434 [25-03-2022].pdf | 25/03/2022 |
| 202214017146-FORM 1 [25-03-2022(online)].pdf | 25/03/2022 |
| 202214017146-POWER OF AUTHORITY [25-03-2022(online)].pdf | 25/03/2022 |
