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HIGH DENSITY OPTICAL/ELECTRICAL INTERCONNECTION ARRANGEMENT WITH HIGH THERMAL EFFICIENCY
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Abstract
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HIGH DENSITY OPTICAL/ELECTRICAL INTERCONNECTION ARRANGEMENT WITH HIGH THERMAL EFFICIENCY
PCT NATIONAL PHASE APPLICATION
Published
Filed on 10 March 2023
Patent Information
| Application ID | 202327015938 |
| Date of Application | 10/03/2023 |
Documents
| Name | Date |
|---|---|
| 202327015938-FORM-26 [19-05-2023(online)].pdf | 19/05/2023 |
| 202327015938-Proof of Right [19-05-2023(online)].pdf | 19/05/2023 |
| Abstract1.jpg | 10/04/2023 |
| 202327015938-FORM 18 [14-03-2023(online)].pdf | 14/03/2023 |
| 202327015938-COMPLETE SPECIFICATION [10-03-2023(online)].pdf | 10/03/2023 |
| 202327015938-DECLARATION OF INVENTORSHIP (FORM 5) [10-03-2023(online)].pdf | 10/03/2023 |
| 202327015938-DRAWINGS [10-03-2023(online)].pdf | 10/03/2023 |
| 202327015938-FORM 1 [10-03-2023(online)].pdf | 10/03/2023 |
| 202327015938-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [10-03-2023(online)].pdf | 10/03/2023 |
| 202327015938-PRIORITY DOCUMENTS [10-03-2023(online)].pdf | 10/03/2023 |
| 202327015938-STATEMENT OF UNDERTAKING (FORM 3) [10-03-2023(online)].pdf | 10/03/2023 |
