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HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES
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Abstract
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HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES
CONVENTIONAL APPLICATION
Published
Filed on 3 June 2020
Patent Information
| Application ID | 202044023272 |
| Date of Application | 03/06/2020 |
Documents
| Name | Date |
|---|---|
| 202044023272-ABSTRACT [11-07-2022(online)].pdf | 11/07/2022 |
| 202044023272-CLAIMS [11-07-2022(online)].pdf | 11/07/2022 |
| 202044023272-FER_SER_REPLY [11-07-2022(online)].pdf | 11/07/2022 |
| 202044023272-OTHERS [11-07-2022(online)].pdf | 11/07/2022 |
| 202044023272-FORM 3 [29-06-2022(online)].pdf | 29/06/2022 |
| 202044023272-FER.pdf | 11/01/2022 |
| 202044023272-FORM 3 [01-06-2021(online)].pdf | 01/06/2021 |
| 202044023272-FORM 18 [08-02-2021(online)].pdf | 08/02/2021 |
| 202044023272-FORM 3 [01-12-2020(online)].pdf | 01/12/2020 |
| 202044023272-FORM-26 [07-08-2020(online)].pdf | 07/08/2020 |
| 202044023272-COMPLETE SPECIFICATION [03-06-2020(online)].pdf | 03/06/2020 |
| 202044023272-DECLARATION OF INVENTORSHIP (FORM 5) [03-06-2020(online)].pdf | 03/06/2020 |
| 202044023272-DRAWINGS [03-06-2020(online)].pdf | 03/06/2020 |
| 202044023272-FORM 1 [03-06-2020(online)].pdf | 03/06/2020 |
