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HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS
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HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS
PCT NATIONAL PHASE APPLICATION
Published
Filed on 29 September 2022
Patent Information
| Application ID | 202247055963 |
| Date of Application | 29/09/2022 |
Documents
| Name | Date |
|---|---|
| 202247055963-FORM 3 [29-03-2023(online)].pdf | 29/03/2023 |
| 202247055963-Proof of Right [30-12-2022(online)].pdf | 30/12/2022 |
| 202247055963.pdf | 30/09/2022 |
| 202247055963-COMPLETE SPECIFICATION [29-09-2022(online)].pdf | 29/09/2022 |
| 202247055963-DECLARATION OF INVENTORSHIP (FORM 5) [29-09-2022(online)].pdf | 29/09/2022 |
| 202247055963-DRAWINGS [29-09-2022(online)].pdf | 29/09/2022 |
| 202247055963-FORM 1 [29-09-2022(online)].pdf | 29/09/2022 |
| 202247055963-POWER OF AUTHORITY [29-09-2022(online)].pdf | 29/09/2022 |
| 202247055963-PRIORITY DOCUMENTS [29-09-2022(online)].pdf | 29/09/2022 |
| 202247055963-STATEMENT OF UNDERTAKING (FORM 3) [29-09-2022(online)].pdf | 29/09/2022 |
