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HEAT EXCHANGER FOR COOLING MULTIPLE LAYERS OF ELECTRONIC MODULES

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HEAT EXCHANGER FOR COOLING MULTIPLE LAYERS OF ELECTRONIC MODULES

CONVENTIONAL APPLICATION

Published

date

Filed on 28 February 2018

Patent Information

Application ID201814007511
Date of Application28/02/2018

Documents

NameDate
201814007511-FORM 3 [20-07-2018(online)].pdf20/07/2018
201814007511-Correspondence-030518-.pdf10/05/2018
201814007511-Correspondence-030518-1.pdf10/05/2018
201814007511-Correspondence-030518.pdf10/05/2018
201814007511-OTHERS-030518-.pdf10/05/2018
201814007511-OTHERS-030518-1.pdf10/05/2018
201814007511-OTHERS-030518-2.pdf10/05/2018
201814007511-OTHERS-030518.pdf10/05/2018
201814007511-CertifiedCopyofPriorityDocument(MANDATORY) [01-05-2018(online)].pdf01/05/2018
201814007511-ProofofRight(MANDATORY) [01-05-2018(online)].pdf01/05/2018
201814007511-VerifiedEnglishtranslation(MANDATORY) [01-05-2018(online)].pdf01/05/2018
201814007511-Correspondence-170418.pdf24/04/2018
201814007511-Power of Attorney-170418.pdf24/04/2018
201814007511-FORM-26 [10-04-2018(online)].pdf10/04/2018
abstract.jpg27/03/2018
201814007511-COMPLETE SPECIFICATION [28-02-2018(online)].pdf28/02/2018
201814007511-DECLARATION OF INVENTORSHIP (FORM 5) [28-02-2018(online)].pdf28/02/2018
201814007511-DRAWINGS [28-02-2018(online)].pdf28/02/2018
201814007511-FORM 1 [28-02-2018(online)].pdf28/02/2018
201814007511-POWER OF AUTHORITY [28-02-2018(online)].pdf28/02/2018
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