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HEAT-DISSIPATING ASSEMBLY FOR ELECTRONIC COMPONENT
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Abstract
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HEAT-DISSIPATING ASSEMBLY FOR ELECTRONIC COMPONENT
CONVENTIONAL APPLICATION
Published
Filed on 3 June 2014
Patent Information
| Application ID | 609/KOL/2014 |
| Date of Application | 03/06/2014 |
Documents
| Name | Date |
|---|---|
| 609-KOL-2014-AbandonedLetter.pdf | 05/07/2019 |
| 609-KOL-2014-FER.pdf | 26/12/2018 |
| 609-KOL-2014-(04-12-2015)-ANNEXURE TO FORM 3.pdf | 04/12/2015 |
| 609-KOL-2014-(05-06-2015)-ANNEXURE TO FORM 3.pdf | 05/06/2015 |
| 609-KOL-2014-(05-06-2015)-CORRESPONDENCE.pdf | 05/06/2015 |
| 609-KOL-2014-(08-07-2014)-CORRESPONDENCE.pdf | 08/07/2014 |
| 609-KOL-2014-(08-07-2014)-FORM-1.pdf | 08/07/2014 |
| 609-KOL-2014-(26-06-2014)-CORRESPONDENCE.pdf | 26/06/2014 |
| 609-KOL-2014-(26-06-2014)-ENGLISH TRANSLATION.pdf | 26/06/2014 |
| Drawings.pdf | 09/06/2014 |
| FORM 2 & Complete Specification.pdf | 09/06/2014 |
| FORM 3.pdf | 09/06/2014 |
| FORM 5.pdf | 09/06/2014 |
| GPA of Delta Electronics Power (Dong Guan) Co., Ltd..pdf | 09/06/2014 |
