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HEAT-DISSIPATING ASSEMBLY FOR ELECTRONIC COMPONENT

CONVENTIONAL APPLICATION

Published

date

Filed on 3 June 2014

Patent Information

Application ID609/KOL/2014
Date of Application03/06/2014

Documents

NameDate
609-KOL-2014-AbandonedLetter.pdf05/07/2019
609-KOL-2014-FER.pdf26/12/2018
609-KOL-2014-(04-12-2015)-ANNEXURE TO FORM 3.pdf04/12/2015
609-KOL-2014-(05-06-2015)-ANNEXURE TO FORM 3.pdf05/06/2015
609-KOL-2014-(05-06-2015)-CORRESPONDENCE.pdf05/06/2015
609-KOL-2014-(08-07-2014)-CORRESPONDENCE.pdf08/07/2014
609-KOL-2014-(08-07-2014)-FORM-1.pdf08/07/2014
609-KOL-2014-(26-06-2014)-CORRESPONDENCE.pdf26/06/2014
609-KOL-2014-(26-06-2014)-ENGLISH TRANSLATION.pdf26/06/2014
Drawings.pdf09/06/2014
FORM 2 & Complete Specification.pdf09/06/2014
FORM 3.pdf09/06/2014
FORM 5.pdf09/06/2014
GPA of Delta Electronics Power (Dong Guan) Co., Ltd..pdf09/06/2014

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